Our Blog
News and explanations about the technologies from our company. Find out more about their applications and our contribution to a constantly changing environment.
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Melanie Erker – with experience, responsibility, and a passion for training
Melanie Erker has been part of AT&S for many years. Her journey began in September 2009, when she was just 15 years old.
Joney Guo – From the beginnings to quality leadership
Joney Guo's career at AT&S exemplifies the development of the Chongqing site and demonstrates how technical expertise and international experience combine to create true leadership in quality.
Design Excellence: Findings from the Pan‑European Electronics Design Conference
PEDC 2026 once again brought together leading experts and engineers who are shaping the future of electronics design. The focus was particularly on AI-supported design tools that make development processes faster and more efficient, while at the same time placing high demands on the secure handling of sensitive data. Another key topic was simulation-driven design development. Of particular note was the presentation by Janagan Papperi (AT&S) entitled “PCB Embedding Technology: A Pathway to Enhanced Product Integration.” He highlighted the advantages and technical challenges of embedding active and passive components directly into printed circuit boards. This technology has a significant impact on the next generation of high-performance electronics.
Multifunctional Cores: Turning the IC Substrate into a System Enabler
As compute, memory, RF (Radio Frequency), photonics, and power delivery compress into ever tighter envelopes, the Multifunctional Core IC Substrate emerges as a decisive enabler. AT&S is developing this new technology within the framework of IPCEI ME/CT (Important Project of Common European Interest on Microelectronics/Communication Technology), and prototype manufacturing is already under way at the new Competence Center for R&D and IC Substrate Production in Leoben.
Glass Core Substrates: From R&D breakthrough to platform technology
Glass, long valued for optical properties, flatness and stability, is now stepping up as a core material in IC substrates. AT&S is one of the key innovators in the development of this new technology and pushes the boundaries of current packaging solutions with its European partners in the IPCEI ME/CT (Important Project of Common European Interest on Microelectronics/Communication Technology).
AT&S tackles challenges of next-gen chip design
Learn more about key technologies like glass core substrates, multifunctional cores, and ultra-high-density substrates in our new series of blog posts about AT&S’s most important research efforts in the field of microchip packaging.
A Journey That Built a Leader: Darius Seng’s Rise with AT&S
What does it take to grow from a Test Manager to a Senior Director of Operations in one of the world’s most advanced technology companies? Darius Seng’s journey through continents, cultures, and cutting-edge technologies offers inspiring insights into leadership, adaptability, and lifelong learning.
High-tech facility at AT&S lays foundations for future high-performance processors
The modern Multiwet Tool at AT&S’s new IC substrate competence center in Leoben enables flexible development of next-generation manufacturing processes. It creates conductive structures just five to two micrometers wide – ideal for powering future high-performance microchips with data and energy.
From the Lens of a Chemistry Enthusiast – Ooi Zing Yi
Chemistry may not be the cup of tea for many. But, for Zing-Yi Ooi, a Lab Specialist and one [...]
AT&S showcases contributions to modern European Microelectronics Ecosystem
On Tuesday, May 20, 2025, AT&S will host the Austrian IPCEI Day 2025 and the AT&S Prototyping Workshop in Leoben. These events will highlight the impressive technological breakthroughs achieved under the IPCEI ME/CT (Important Project of Common European Interest on Microelectronics and Communication Technologies) umbrella by AT&S and its Austrian IPCEI partners.
A Bridge Between Cultures – Saikhantuya Buyannasan
Saikhantuya Buyannasan, known as Tuya, is a global citizen with Mongolian roots who feels at home both professionally and culturally in Europe. She has learned to build bridges between Asia and Europe, bringing her diverse experiences to AT&S.
New materials for sustainable transportation systems
Together with partners from industry and research, AT&S has developed semiconductor modules for onboard chargers and inverters for electric cars. By using the semiconductor material gallium nitride, the inverter could be made significantly smaller and lighter than with the silicon base used today.
From Nigeria to India: The inspiring journey of chemist Vivian Suru John-Denk
Vivian Suru John-Denk is not only a talented scientist but also a woman with a clear vision and a strong belief in the power of resilience and teamwork. Her journey has taken her from Nigeria to South Africa, Europe, and finally to India, where she has deepened her expertise in chemistry and set new standards as a leader.
It is all about passion for engineering – James Fung
Meet James Fung, our Production Director at AT&S in Chongqing, China. He tells his personal story beginning in Hong Kong and later developing some of the most significant milestones at AT&S.
Highway to Hell: Ultra-robust electronics for self-driving trucks
In the European research project CHARM, AT&S has been involved in the development of complex electronic systems that can withstand the harsh conditions in deep mine shafts and other extreme environments. The SiP developed by AT&S engineers combines low power consumption with optimum thermal management.
A man who lives for his region – Manfred Fastl
From the heart of the Styrian Vulkanland Region comes Manfred Fastl, a man who combines groundedness, innovation, and team spirit in an impressive way. Over 25 years at AT&S, he has risen from Process Technician to a member of the local leadership team, achieving milestones with the goal of fostering efficiency and unity.
Virtual First: AT&S focuses on virtual development
AT&S is a pioneer in the electronics industry when it comes to the introduction and use of digital tools in the development of new products and processes. Over the past ten years, the company has acquired unique knowledge in the fields of material characterization and simulation.
More Than a Decade of Dedication – Evian Tang
It was ten years ago. It started with an unexpected call from a headhunter. And it lead to a stunning AT&S career centered around Chongqing, China. In an industry known for rapid changes and new opportunities, Evian Tang’s commitment to AT&S is remarkable.
Kulim from Day One – Nur Shazana Mohd Faisal
Aidilfitri and Nasi Kandar in Malaysia, Christmas and pretzels in Germany – welcome to the world of an AT&S pioneer, exciting and varied, both professionally and personally.
From Milano to global AT&S – Alessandro Palmeri
Amateur soccer player, hobby sommelier, thoroughbred salesman – you can combine all of these if you make a vertical take-off at Sales. Please fasten your seatbelts, we also have to go through an earthquake in Taipei.
Sub-5 micrometers: AT&S enters a new dimension with IPCEI
As part of the EU-funded IPCEI on Microelectronics and Communication Technologies project, AT&S is developing a new generation of IC substrates that can establish connections between several high-performance chips and a printed circuit board and allow processors to communicate quickly and efficiently with other components of a computer.
Research: European Microelectronics in the fast lane
As part of the "IPCEI on Microelectronics and Communication Technologies" funding project, the European Union is supporting research institutions and industrial partners in the development of technology that will enable a sustainable yet powerful data infrastructure for the continent. AT&S is involved in the project as a manufacturer of highly efficient substrates for the next generation of microchips. New research and production capacities in Leoben will play a decisive role in the modernization of the European microelectronics industry.
Focus AI: 2023 marks the start of the era of Artificial Intelligence
From ChatGPT to EU regulation of artificial intelligence: 2023 has ushered in a new phase of digitalization that will transform our society.
Focus AI: Indiana Jones for all eternity
The resurrection of the Beatles for new songs and Sean Connery as the best James Bond ever in new films? This will soon no longer be a problem for the brave new world of AI.
Focus AI: If artificial intelligence dreams, then it dreams of new hardware
Glasses that can see, hear, and talk thanks to AI. iPhone designer Jony Ive, who is supposed to develop a new AI device together with OpenAI and an investment of billions: Generative artificial intelligence will influence the shape of future hardware.
Patrick Lenhardt – when down-to-earth roots meet global technology
What happens when someone starts their first job with an open mind and an unshakable drive to grow? Step by step, challenge by challenge, achievement by achievement – this is the story of ambition matched with relentless effort.
“A joint project” – Brigitte Achatz on career, family, and true collaboration
Some life paths are meticulously planned, while others evolve step by step – through opportunities, courage, and the people who accompany you along the way. Brigitte Achatz’s professional journey clearly belongs to the latter category.
Mohd Sholihin Abd Razak – Facility Excellence at the Kulim Campus
Some of the most important contributions happen away from the spotlight – in the background, where structure is created. When Mohd Sholihin Abd Razak joined AT&S Malaysia in August 2023, the Kulim Campus was still under construction, shaped by mud, temporary paths, and ongoing building work. This is where his AT&S journey began.
Melanie Erker – with experience, responsibility, and a passion for training
Melanie Erker has been part of AT&S for many years. Her journey began in September 2009, when she was just 15 years old.
Joney Guo – From the beginnings to quality leadership
Joney Guo's career at AT&S exemplifies the development of the Chongqing site and demonstrates how technical expertise and international experience combine to create true leadership in quality.
Design Excellence: Findings from the Pan‑European Electronics Design Conference
PEDC 2026 once again brought together leading experts and engineers who are shaping the future of electronics design. The focus was particularly on AI-supported design tools that make development processes faster and more efficient, while at the same time placing high demands on the secure handling of sensitive data. Another key topic was simulation-driven design development. Of particular note was the presentation by Janagan Papperi (AT&S) entitled “PCB Embedding Technology: A Pathway to Enhanced Product Integration.” He highlighted the advantages and technical challenges of embedding active and passive components directly into printed circuit boards. This technology has a significant impact on the next generation of high-performance electronics.
Multifunctional Cores: Turning the IC Substrate into a System Enabler
As compute, memory, RF (Radio Frequency), photonics, and power delivery compress into ever tighter envelopes, the Multifunctional Core IC Substrate emerges as a decisive enabler. AT&S is developing this new technology within the framework of IPCEI ME/CT (Important Project of Common European Interest on Microelectronics/Communication Technology), and prototype manufacturing is already under way at the new Competence Center for R&D and IC Substrate Production in Leoben.
Glass Core Substrates: From R&D breakthrough to platform technology
Glass, long valued for optical properties, flatness and stability, is now stepping up as a core material in IC substrates. AT&S is one of the key innovators in the development of this new technology and pushes the boundaries of current packaging solutions with its European partners in the IPCEI ME/CT (Important Project of Common European Interest on Microelectronics/Communication Technology).
AT&S tackles challenges of next-gen chip design
Learn more about key technologies like glass core substrates, multifunctional cores, and ultra-high-density substrates in our new series of blog posts about AT&S’s most important research efforts in the field of microchip packaging.
A Journey That Built a Leader: Darius Seng’s Rise with AT&S
What does it take to grow from a Test Manager to a Senior Director of Operations in one of the world’s most advanced technology companies? Darius Seng’s journey through continents, cultures, and cutting-edge technologies offers inspiring insights into leadership, adaptability, and lifelong learning.
High-tech facility at AT&S lays foundations for future high-performance processors
The modern Multiwet Tool at AT&S’s new IC substrate competence center in Leoben enables flexible development of next-generation manufacturing processes. It creates conductive structures just five to two micrometers wide – ideal for powering future high-performance microchips with data and energy.
From the Lens of a Chemistry Enthusiast – Ooi Zing Yi
Chemistry may not be the cup of tea for many. But, for Zing-Yi Ooi, a Lab Specialist and one [...]
AT&S showcases contributions to modern European Microelectronics Ecosystem
On Tuesday, May 20, 2025, AT&S will host the Austrian IPCEI Day 2025 and the AT&S Prototyping Workshop in Leoben. These events will highlight the impressive technological breakthroughs achieved under the IPCEI ME/CT (Important Project of Common European Interest on Microelectronics and Communication Technologies) umbrella by AT&S and its Austrian IPCEI partners.
A Bridge Between Cultures – Saikhantuya Buyannasan
Saikhantuya Buyannasan, known as Tuya, is a global citizen with Mongolian roots who feels at home both professionally and culturally in Europe. She has learned to build bridges between Asia and Europe, bringing her diverse experiences to AT&S.
New materials for sustainable transportation systems
Together with partners from industry and research, AT&S has developed semiconductor modules for onboard chargers and inverters for electric cars. By using the semiconductor material gallium nitride, the inverter could be made significantly smaller and lighter than with the silicon base used today.
From Nigeria to India: The inspiring journey of chemist Vivian Suru John-Denk
Vivian Suru John-Denk is not only a talented scientist but also a woman with a clear vision and a strong belief in the power of resilience and teamwork. Her journey has taken her from Nigeria to South Africa, Europe, and finally to India, where she has deepened her expertise in chemistry and set new standards as a leader.
It is all about passion for engineering – James Fung
Meet James Fung, our Production Director at AT&S in Chongqing, China. He tells his personal story beginning in Hong Kong and later developing some of the most significant milestones at AT&S.
Highway to Hell: Ultra-robust electronics for self-driving trucks
In the European research project CHARM, AT&S has been involved in the development of complex electronic systems that can withstand the harsh conditions in deep mine shafts and other extreme environments. The SiP developed by AT&S engineers combines low power consumption with optimum thermal management.
A man who lives for his region – Manfred Fastl
From the heart of the Styrian Vulkanland Region comes Manfred Fastl, a man who combines groundedness, innovation, and team spirit in an impressive way. Over 25 years at AT&S, he has risen from Process Technician to a member of the local leadership team, achieving milestones with the goal of fostering efficiency and unity.
Virtual First: AT&S focuses on virtual development
AT&S is a pioneer in the electronics industry when it comes to the introduction and use of digital tools in the development of new products and processes. Over the past ten years, the company has acquired unique knowledge in the fields of material characterization and simulation.
More Than a Decade of Dedication – Evian Tang
It was ten years ago. It started with an unexpected call from a headhunter. And it lead to a stunning AT&S career centered around Chongqing, China. In an industry known for rapid changes and new opportunities, Evian Tang’s commitment to AT&S is remarkable.
Kulim from Day One – Nur Shazana Mohd Faisal
Aidilfitri and Nasi Kandar in Malaysia, Christmas and pretzels in Germany – welcome to the world of an AT&S pioneer, exciting and varied, both professionally and personally.
From Milano to global AT&S – Alessandro Palmeri
Amateur soccer player, hobby sommelier, thoroughbred salesman – you can combine all of these if you make a vertical take-off at Sales. Please fasten your seatbelts, we also have to go through an earthquake in Taipei.
Sub-5 micrometers: AT&S enters a new dimension with IPCEI
As part of the EU-funded IPCEI on Microelectronics and Communication Technologies project, AT&S is developing a new generation of IC substrates that can establish connections between several high-performance chips and a printed circuit board and allow processors to communicate quickly and efficiently with other components of a computer.
Research: European Microelectronics in the fast lane
As part of the "IPCEI on Microelectronics and Communication Technologies" funding project, the European Union is supporting research institutions and industrial partners in the development of technology that will enable a sustainable yet powerful data infrastructure for the continent. AT&S is involved in the project as a manufacturer of highly efficient substrates for the next generation of microchips. New research and production capacities in Leoben will play a decisive role in the modernization of the European microelectronics industry.
The people behind AT&S
Get to know the people behind the company and learn more about their passion.
