Milestones in the history of AT&S
From state ownership to a global enterprise. The AT&S success story started with several companies in Austria’s state-owned electronics industry and has reached its current peak with construction work underway in Malaysia and at the headquarters in Leoben. Its rise from a small Austrian company to a global enterprise with plans for further expansion is based on a corporate philosophy that has bright minds, brave investments and innovation at its heart.
Company founded following a merger of several companies in state-owned Austrian industry
Privatisation and sale to Androsch, Dörflinger and Zoidl
IPO on Frankfurt Stock Exchange (‘New Market’ segment)
Acquisition of Indal Electronics Ltd., the largest Indian PCB factory, in Nanjangud – now AT&S India Private Limited
Expansion in Shanghai – one of the world’s leading locations for HDI manufacturing
Acquisition of the Korean printed circuit board manufacturer Tofic Co. Ltd. – today, AT&S Korea Co. Ltd.
AT&S switches to the Vienna Stock Exchange
New production focus: Austrian factories produce goods for premium niches in the automotive and industrial segment. Shanghai concentrates on high-end mobile devices
Meet Paul Eisler
Paul Eisler, the inventor of the printed circuit board, was born in Vienna. Without his ingenious creation, the electronics industry and its revolutionary impact on data processing, transport, entertainment and almost every other area of life in recent decades would have been inconceivable. As an Austrian company, AT&S has a direct historical link to the origins of the PCB.
Production starts at Factory II in India
Groundbreaking for new factory in Chongqing, China
Capacity increase in Shanghai by 30%
AT&S enters the IC substrate segment in cooperation with a leading semiconductor manufacturer
AT&S generates record turnover and profit in 2014/15 and decides to increase the budget of its Chongquing investment programme from €350 million to €480 million
AT&S starts series production of IC substrates at its Chongqing facility
Successful introduction and optimisation of mSAP technology in Shanghai and Chongqing
Start of the second expansion phase at Factory 1 in Chongqing
Construction begins on Factory 3 in Chongqing for IC substrates
Groundbreaking for new factory in Kulim, Malaysia
Construction of plant 3 in Leoben Hinterberg for R&D center and IC substrates starts
HTB3 Ramp-up
Kulim Opening
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