Products

As leaders in the sector when it comes to technology, our printed circuit boards and substrates guarantee maximum possible performance within the smallest space. Our circuits can be adapted to any profile of requirements with our advanced technologies, whether as a mainboard for PCs, smartphones and servers, or as control systems for cars or industrial plants.

Our products

2.5D® Cavity printed circuit boards

2.5D® technology from AT&S makes printed circuit boards extremely compact and flexible enough to bend for installation.

2.5D® Cavity printed circuit boards

Double-sided printed circuit boards

Double-sided printed circuit boards form the very foundation of the electronics industry. Due to their superb heat dissipation properties, AT&S double-sided circuit boards are ideal for applications involving high currents.

Double-sided printed circuit boards

ECP®

By “burying” components within a circuit board, we create a third functional level: valuable space is now also available for components inside the circuit board, instead of just on the top and bottom.

ECP®
Close-up of a flexible printed circuit board integrated with a plug connector. The conductor tracks run precisely across the flexible surface and are connected to a fixed electronic component.

Flexible and rigid-flex printed circuit boards

Flexible printed circuit boards can be bent or twisted during assembly, so they can be integrated into devices with almost any form factors and space constraints.

Flexible and rigid-flex printed circuit boards

HDI printed circuit boards

In printed circuit board manufacturing, “HDI” stands for “high density interconnect”. The high circuit density and small structures enable tiny form factors and make the process of controlling engines and other complex systems efficient.

HDI printed circuit boards

Modules

AT&S modules combine complex electronic circuits in easy-to-handle system components - small, powerful and efficient.

Modules
Close-up of several rectangular copper conductor tracks arranged in parallel on a dark blue surface. The tracks have a shiny surface and are evenly aligned.

mSAP

mSAP enables AT&S to manufacture printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry.

mSAP

Multilayer printed circuit boards

Multilayer printed circuit boards are AT&S’s core business and form the basis for most technologies used for further miniaturizing electronic circuits and systems.

Multilayer printed circuit boards

Substrate-like printed circuit boards

Substrate-like PCBs are the pinnacle of miniaturization. The circuits on substrate-like PCBs are significantly smaller than anything previously possible in the PCB industry.

Substrate-like printed circuit boards

Test & reference boards

Quality control is a major concern in the semiconductor industry. The ultra-fine structures on modern microchips are not particularly forgiving of mistakes. AT&S test boards facilitate the checking process.

Test & reference boards

Thermally enhanced printed circuit boards

AT&S thermally enhanced printed circuit boards allow heat to be dissipated efficiently to protect electronic circuits and components from overheating.

Thermally enhanced printed circuit boards

Z-Interconnect

Z-Interconnect is a technology developed by AT&S that makes it possible to integrate two or more circuit boards designed for different requirements into one system from a single source.

Z-Interconnect