Products

2.5D® technology from AT&S makes printed circuit boards extremely compact and flexible enough to bend for installation.

Double-sided printed circuit boards form the very foundation of the electronics industry. Due to their superb heat dissipation properties, AT&S double-sided circuit boards are ideal for applications involving high currents.

By “burying” components within a circuit board, we create a third functional level: valuable space is now also available for components inside the circuit board, instead of just on the top and bottom.

Flexible printed circuit boards can be bent or twisted during assembly, so they can be integrated into devices with almost any form factors and space constraints.

In printed circuit board manufacturing, “HDI” stands for “high density interconnect”. The high circuit density and small structures enable tiny form factors and make the process of controlling engines and other complex systems efficient.

AT&S modules combine complex electronic circuits in easy-to-handle system components - small, powerful and efficient.

mSAP enables AT&S to manufacture printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry.

Multilayer printed circuit boards are AT&S’s core business and form the basis for most technologies used for further miniaturizing electronic circuits and systems.

Substrate-like PCBs are the pinnacle of miniaturization. The circuits on substrate-like PCBs are significantly smaller than anything previously possible in the PCB industry.

Quality control is a major concern in the semiconductor industry. The ultra-fine structures on modern microchips are not particularly forgiving of mistakes. AT&S test boards facilitate the checking process.

AT&S thermally enhanced printed circuit boards allow heat to be dissipated efficiently to protect electronic circuits and components from overheating.

Z-Interconnect is a technology developed by AT&S that makes it possible to integrate two or more circuit boards designed for different requirements into one system from a single source.