HDI printed circuit boards

A Breakthrough in Miniaturization with HDI Technology

In printed circuit board manufacturing, “HDI” stands for “high density interconnect”. HDI printed circuit boards have played an important role in the history of AT&S; indeed, they marked the beginning of the company’s rise to become the market leader in the manufacture of high-end PCBs. The high circuit density and small structures of an HDI PCB enable tiny form factors for devices like mobile phones and digital cameras, and make the process of controlling engines and other complex systems efficient.

In 1997, the first HDI multilayer printed circuit boards were developed for mass production for the mobile phone market, which was in its infancy. The multilayer printed circuit boards made it possible to embed complex circuits within a small space. The high degree of miniaturisation, the short and rapid signal paths and the resulting reduction in energy consumption were exactly what mobile phone manufacturers needed at the time.

To achieve this, laser drilling systems were used for the first time to create precise holes in the printed circuit board. This established the new practice of working with sequential build-up (SBU) layers, which are pressed layer by layer into a compact circuit board. Ever since then, HDI printed circuit boards have been indispensable in the electronics industry ever since.

HDI printed circuit boards are used in satellite communications, driving assistance systems, consumer electronics, aircraft, engine controls, digital cameras, smartphones and medical devices.

The booming electronics industry has already developed a whole array of new products featuring Anylayer technology. Powerful smartphones, wireless headphones, miniaturised video cameras, smart glasses and tiny sensors for industry and medical technology could not have been achieved by any other means. If maximum performance is required in a tiny space, HDI Anylayer printed circuit boards provide the solution.

Anylayer technology is the next step in the evolution of HDI printed circuit boards. All of the connections between the individual layers of the printed circuit board are created in the form of laser-drilled holes, known as microvias. This saves space and improves signal conductivity. There are almost no constraints on the way that individual layers of a printed circuit board can be interconnected using this method. Electronics manufacturers can create even more complex circuits with HDI Anylayer printed circuit boards, while miniaturising their devices to an even greater degree at the same time.

The booming electronics industry has already developed a whole array of new products featuring Anylayer technology. Powerful smartphones, wireless headphones, miniaturised video cameras, smart glasses and tiny sensors for industry and medical technology could not have been achieved by any other means.