Rethinking the basics of PCB and IC Substrate manufacturing with mSAP
mSAP technology enables the production of printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry. mSAP stands for “modified semi-additive process” – a technology in which the conducting paths used to conduct signals on a printed circuit board or substrate are not etched out of a copper layer in the usual way. Instead, the conductive material is only applied to the PCB in places where it is actually needed. Unlike the conventional method, this enables significantly tighter signal lines and smaller distances between the conducting paths.
By adopting this technology, AT&S, as a leading PCB manufacturer, is increasing the number of increasingly small structures that can be placed on a PCB. With mSAP, copper is only applied to the places where electricity will later flow. What’s more, it is done so precisely that the conducting paths can be placed closer together. mSAP (Modified Semi Additive Process) takes miniaturization in microelectronics to the next level.
Benefits of mSAP technology
- mSAP saves space as it allows denser conducting path layouts. This opens the way for the miniaturization of PCBs and devices.
- Short signal paths enhance signal transmission on the PCB.
- mSAP offers better performance at a smaller size.
- Radically thin PCBs for radically thin devices.
- mSAP shrinks PCBs, freeing up space for sensors, cameras and larger batteries.
Radical miniaturization
mSAP provides another boost to miniaturization for the electronics industry, as circuits can be planned and realized in exceedingly compact spaces, thanks to their smaller form factor. It also reduces the risk of short circuits on densely packed circuit boards, because (unlike their chemically created counterparts) mSAP conducting paths do not require triangular cross sections. This means that although the distances between the lines grows smaller, there is no risk of signal interference.
mSAP in practice
Smile for the camera
With mSAP, powerful electronic circuits can be installed in the smallest of spaces, which is essential for very thin, compact device like smartphones and hearing aids. mSAP (Modified Semi Additive Process) is also ideal for processing the high-frequency signals that will be used by future generations of mobile networks. The compactness of mSAP PCBs and their short signal paths allow them to process high-frequency signals with virtually no loss. mSAP systems have recently proven their worth in the development of cameras for modern smartphones. Only the highly compact mSAP PCBs made it possible to combine multiple cameras in one microelectronic system. Radical miniaturization of this kind also lowers the power requirements – an incredibly important consideration for devices that rely on batteries.
Want to learn more about miniaturization for medical applications?
Various technologies and solutions can be used to realize the benefits of miniaturization and heterogeneous integration.
In our whitepaper, we take a closer look at three of them and show how they can help you implement innovative medical applications.
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