Flip-chip technology forms the basis for the connection technology and packaging of the high-performance semiconductors found in every modern computer. This process creates thousands of contacts via tiny solder balls between the microchip’s connections and the substrate. This type of connection is efficient and enables contact densities that cannot be achieved with older technologies.
At AT&S, we use an advanced assembly method to produce substrates. This process is highly automated and non-contact, and takes place entirely in a cleanroom environment.