Innovation is an important cornerstone of AT&S corporate culture. Through bold investment and many years of research and development, we have developed a whole catalogue of technologies, including some with patents pending. Our state-of-the-art production processes allow us to constantly push the boundaries of what is possible for our customers.
With our mSAP technology,we bring additive processes to the printed circuit board industry for the first time, which combines smaller traces and optimal signal routing. Our 2.5D and embedded component packaging technology platforms bring a new dimension to the miniaturisation of circuits, while our Z-Interconnect technology is setting new standards in bringing printed circuit boards into line with completely different performance requirements. We are constantly developing our technologies and finding ways of using them together to create perfect printed circuit boards and substrates for every application.