Technologies

Thanks to bold investments and a powerful research strategy, AT&S has become a technology leader in the microelectronics industry in recent years. With its numerous innovations, the company is helping to make circuits and devices increasingly powerful while their size continues to shrink. Our developments are one key reason why an amount of computing power that used to require entire data centers can now fit in our pockets.

Our engineers are working on the major challenges of our time and are constantly developing new solutions to manage data and energy even more efficiently and in a more space-saving manner. Our technologies are an important building block for the sustainable and efficient data, transport and energy networks of the future and enable our customers implement their ambitious innovative ideas smoothly.

Our technologies

2.5D® Technology

2.5D® technology from AT&S makes printed circuit boards extremely compact and flexible enough to bend for installation.

2.5D® Technology

Advanced packaging

Advanced Packaging from AT&S is the technological basis for the next generation of high-performance microchips.

Advanced packaging

Cavity printed circuit boards

Cavity PCBs by AT&S open up new possibilities for our customers for space-saving designs, efficient thermal management, reduction of signal losses and integration of components.

Cavity printed circuit boards

ECP®

By “burying” components within a circuit board, we create a third functional level: valuable space is now also available for components inside the circuit board, instead of just on the top and bottom.

ECP®
Close-up of several rectangular copper conductor tracks arranged in parallel on a dark blue surface. The tracks have a shiny surface and are evenly aligned.

mSAP

mSAP enables AT&S to manufacture printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry.

mSAP

Power Packaging

Power packaging by AT&S enables safe and efficient management of high currents and high voltages in the smallest of spaces.

Power Packaging

Radio Frequency Electronics

Radio Frequency Electronics by AT&S are essential for building the wireless data infrastructure that will enable the next evolutionary step in digitalization.

Radio Frequency Electronics

SLP & HDI

SLPs and HDIs by AT&S make it possible to miniaturize the structures on PCBs even further and to reduce space requirements and power consumption.

SLP & HDI

System in Package (SiP)

SIPs by AT&S represent the next step in the miniaturization of electronic systems: less space required, more functionality.

System in Package (SiP)

Z-Interconnect

Z-Interconnect is a technology developed by AT&S that makes it possible to integrate two or more circuit boards designed for different requirements into one system from a single source.

Z-Interconnect