ECP® (embedded component packaging) printed circuit boards

The most compact printed circuit boards in the world

Our printed circuit boards with ECP® technology are the culmination of years of development work in the field of miniaturisation. By “burying” components within a circuit board, we create a third functional level: valuable space is now also available for components inside the circuit board, instead of just on the top and bottom. This allows such a board to fulfil many more functions than a conventional board of the same size. Our ECP® printed circuit boards are used in high-tech applications ranging from medical technology to consumer electronics.

AT&S Explainer Movie - Embedded Component Packaging

Product benefits at a glance

  • ECP® printed circuit boards enable more compact systems and smaller devices.
  • Moving components inside the printed circuit board affords them better protection, while freeing up room on the outer layers.

High precision with laser technology

To place components inside a printed circuit board, we remove targeted areas of material from its inner layers using state-of-the-art laser technology. The components are then placed in the recesses so that no gaps remain. The connections are then created by laser drilling.

AT&S uses the latest laser technology to create the most compact circuit ever to be produced with PCB (printed circuit board) sector tools.

Access systems, implants and tablets

ECP® printed circuit boards are important within diverse areas of the electronics industry. Their thin design makes them ideal for use in ultra-thin smartphones and tablets. Tiny communication modules can also be enclosed in smart pens and other unusual form factors that open up new possibilities in consumer electronics.

Speaking of smartphones, these small circuit boards enable a larger, longer-lasting battery. Chargers with ECP® technology enable these batteries to charge more quickly. Electronic access controls, data centres, smart factories and medical technology all benefit from the reduced system size and enhanced reliability of these PCBs.

Hearing aids connect to TVs, doorbells and smartphones. With integrated ECP® printed circuit boards, they are small and comfortable.
ECP® printed circuit boards charge smartphone, laptop and tablet batteries efficiently without making chargers huge.
ECP® circuit boards provide an efficient power supply to the graphics card cores used in many data centres. This saves a lot of space and valuable energy.

Learn more about SIP system-in-package technology in our webinar

Technical details

Product CharacteristicsSpecifications
Layer count4 to 12 layers
Embedded core layer count2 or 4 layers
Copper nominal thicknessRCC: 12 to 22 µm
PP: 12 to 35 µm
Die to package ratio>35%
Component thickness60 to 300 µm

Would you like to find out more?

Discover more about the most compact printed circuit boards in the world, serving the global medical, power electronics, data management, industrial, aerospace and communication sectors for more than 10 years.

Download our whitepaper to uncover the capabilities of our Embedding Component Packaging technology and applications.

Printed circuit boards with ECP® technology from AT&S are the culmination of years of development work in miniaturisation.


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