With the growing technical performance requirements and ever shorter product life cycles, the trend towards modularisation will continue apace over the coming years. Mindful of this, AT&S is now also developing the market for modules. By including previously tested modules, customers can integrate entire systems into their production more easily and quickly. This allows them to bring their products to market even faster, saving vast amounts of time and expense.
The AT&S toolbox includes printed circuit boards, IC substrates and component embedding. This allows us to support module integration for sensors, connectivity, wireless communication, power management and data storage. Custom solutions are also possible in collaboration with our R&D team and the new R&D line.