IC substrates for High-Performance Computing

IC substrates

AT&S is leading the industry in high yielding advanced interconnect solutions. State-of-the-art capacities, reliable production processes and innovative IC substrate technologies available from multiple locations worldwide to address industry needs across a wide range of applications.

In this whitepaper, learn how AT&S has further expanded IC substrates capabilities, aligning to the market trends, and addressing the needs of the world’s most sophisticated microchips for servers, computers, and other devices.

Cover page of the AT&S whitepaper “IC Substrates,” featuring the title, an introduction section, and a stylized illustration of a microchip with circuit interconnections.

DOWNLOAD WHITEPAPER

Download the whitepaper

Fill out the form now to get your copy of the IC substrates whitepaper and discover how advanced interconnect solutions can benefit advanced applications.

Address your high-performance application needs with IC substrates from AT&S for flip-chip technologies.

Digitalization has been moving forward with tremendous pace in the last decade and was greatly accelerated by the pandemic. At the same time, new applications emerged and the data traffic and processing needs have significantly increased, driving further the demands for high performance computing, storage, networking, connectivity and sensing devices, cloud and edge computing, and artificial intelligence, and the infrastructure required to support them.

IC substrates are essential to produce more complex IC designs. Challenged with scarcity in supply, the forecast for production of substrates sees an expontial rise in demand.

Advanced manufacturing capabilities

Close-up view of advanced IC substrate manufacturing, showing precise microelectronic structures and layered circuitry.

High performance, best in class yields across several applications, including large body sizes & multiple layers.

Customer focus & partner collaboration

Customer‑focused IC substrate solutions, showing interconnected microelectronic structures and system-level integration.

AT&S works with top-tier customers in the market today with great reputations.

Innovative technologies & programs

Innovation and technology in IC substrate development, showing advanced microelectronic structures and connectivity.

Featuring Embedded Cavity,
Multi-Core, and
Fan Out Panel Level Packaging (FOPLP) applications.

Addressing the challenges faced by customers for high-performance applications

High-Performance Computing

AI
Client
Cloud Computing

AI
Cloud Servers

Automotive

Networking
Communications

Globe icon

5G
Gaming

We empower customers to optimize their electronic solutions with:

  • Advanced manufacturing capabilities
  • Flexibility and adaptability to the needs of our customers
  • Innovative technologies & programs
  • State-of-the-art operations
  • Supply chain stability
  • Multiple locations: China, Austria, Malaysia
  • Design and simulation services
  • R&D collaboration
  • Pathfinding activities, joint development programs
  • Capacity reservations
  • Awarded customer support
  • Dedicated regional support

Resilient production network for IC substrates

Hinterberg, Austria

Aerial view of the AT&S headquarters and production site in Hinterberg, Leoben, surrounded by green fields and hills.

First European competence center for R&D & IC substrate production.

Chongqing, China

Aerial view of the AT&S IC substrate production site in Chongqing, China, showing large industrial buildings surrounded by greenery.

Solid production record since 2016 and capacity expansion.

Kulim, Malaysia

Aerial view of the AT&S IC substrate production site in Kulim, Malaysia, showing modern industrial buildings surrounded by greenery.

New campus and location with the capacity for expansion.

Download the IC substrates whitepaper

Learn how customers can stay ahead in the competitive market with cutting-edge IC substrates that excel in performance and quality.

Contact us for more information.