Powerful, fast and always cool
EMBEDDED COMPONENT PACKAGING (ECP®)
AT&S’s embedding technology takes your innovations to the next level.
Want to know how AT&S ECP® technology has served global medical, power electronics, industrial, aerospace and communication sectors for more than 10 years?
Then download this whitepaper to uncover the capabilities of our Embedding Component Packaging technology and applications.
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To discover more about the most compact printed circuit boards in the world, complete the form below to download the whitepaper.
