Powerful, fast and always cool
EMBEDDED COMPONENT PACKAGING (ECP®)
AT&S’s embedding technology takes your innovations to the next level.
Want to know how AT&S ECP® technology has served global medical, power electronics, industrial, aerospace and communication sectors for more than 10 years?
Then download this whitepaper to uncover the capabilities of our Embedding Component Packaging technology and applications.
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To discover more about the most compact printed circuit boards in the world, complete the form below to download the whitepaper.

Advanced developments in tools and technologies, such as laser-cutting and new interconnect technologies, have made it possible to place complex components within the PCB, which reduces system size and frees up valuable space on the surface of the PCB.


Compact power modules with AT&S’s embedding technology offers lower system-level costs, lower weight and greater efficiency with improved power management applications – a game changer for the automotive, medical, consumer electronics and communication industries.