Semiflexible printed circuit boards differ from fully flexible ones in the materials used, as well as in the restricted bending radii and the limited number of bending cycles. Instead of polyimide, we use standard FR4 thin laminate materials as a more economical alternative in certain applications.
In semiflexible printed circuit boards, AT&S offers:
- Thin, double-sided FR4 materials
- Maximum of five bending cycles with a 5mm bending radius
- Cost effective flex-to-install solutions
- Soldering without pre-baking
- More stable construction, simplifying handling during assembly
Technology Sheet
| Capabilities | Standard Production | Advanced Production |
|---|---|---|
| Layer Count / Technology | 2 Layer PTH | 2 Layer PTH |
| PCB Thickness Range | 0.15 mm - 0.18 mm | 0.15 mm - 0.18 mm |
| Materials | FR4 (125µm Dielectric) | FR4 (125µm Dielectric) |
| Glass Transition Temperature | 105°C / 140°C | 105°C / 140°C |
| Copper Thickness | 18µm / 35µm / 70µm | 18µm / 35µm / 70µm |
| Copper Plating Holes | 20µm | 13µm / 20µm |
| Min. Line / Spacing | 100µm / 100µm | 50µm / 50µm |
| Soldermask Registration | +/- 150µm Screen print | +/- 100µm (Photoimageable) |
| Min. Soldermask Dam | 150µm | 100µm |
| Soldermask Color | Green | Green |
| Max. PCB Size | 580 mm x 500 mm | 580 mm x 500 mm |
| Production Panel | 609.6 mm x 530 mm 609.6 mm x 457.2 mm | 609.6 mm x 530 mm 609.6 mm x 457.2 mm |
| Min. Annular Ring | 150µm | 0µm |
| Smallest Drill | 0.28 mm | 0.2 mm |
| Smallest Routing Bit | 0.8 mm | 0.8 mm |
| Surfaces | OSP / Immersion Tin Immersion Ni/Au Plated Ni/Au | OSP / Immersion Tin Immersion Ni/Au Plated Ni/Au |
| Scoring | Yes | Yes |
| ID Print | White | White |
| Blue Mask & Carbon Print | Yes | Yes |