New Infrastructure Project “Exploration!PVD” started

As part of its R&D line, AT&S has decided to purchase a physical thin film system “Clusterline 600” from Evatec. This system enables AT&S and you to dive into the world of semiconductor processes. The process technology is so novel that AT&S is currently the only European PCB and IC substrate manufacturer to operate such a facility. This new technology is used for the development of next-generation IC substrates, novel embedding concepts, heterogeneous integration, advanced packaging and FO-PLP (Fan-Out – Panel Level Packaging).

The PVE/PVD system in brief:

• Substrate sizes from coupons (3×3 cm) up to 625x625mm.
• Titanium deposition: 25-100 nm
• Copper deposition: 25-300 nm
• Materials: FR4 and films (e.g. polyimide, ABD, …)

Location:

• Leoben/Hinterberg, Austria

Purpose:

• Coating of dielectric PCB material with titanium and copper.
• Contacting of embedded components (no copper termination on front/back side) without laser drilling.
• Reactive etching and
• Plating of z-axis interconnects of next generation printed circuit boards/IC-S dielectrics.

Highlights:

• Clean room with ISO6/8
• Atmospheric outgassing furnace (under nitrogen atmosphere)
• Static substrates during processing for best cooling and particle performance
• Built-in metrology for residual gas analysis

Book your experiments:

Do you have an idea? Then take advantage of this unique opportunity to conduct experiments with a completely new technology that is not yet established in the PCB/IC-Substrate industry. Thin film deposition has become an integral part of the semiconductor, optical and tribological world. You have the opportunity to pre-test these new concepts.

The test possibilities include tests on:

• Vacuum suitability of the envisioned materials for your application.
• Thin film coatings on new types of printed circuit board materials or embedded components