AT&S to exhibit at Electronica China 2019

AT&S, one of the globally leading high-end connectivity solutions providers, exhibits at the Electronica China held from March 20-22, 2019 at the Shanghai New International Expo Center.

Shanghai and Leoben, 19 March 2019 – The company will show case its products and solutions supporting all of the mega trends in telecommunication, automotive electronics, wearables and medical electronics. Advancing miniaturization, high data rates and/or high frequencies, power electronics with increasing current densities and rising thermal problems, as well as optimized production processes are the challenges that modern applications face. AT&S presents solutions for extremely compact substrates/modules, advanced heat management, Embedded Component Packaging (ECP®), HF printed circuit boards (PCBs) and flexible PCBs.

“Given the current mega trends such as 5G, IoT (Internet of Things), AI (Artificial Intelligence), Autonomous driving and Machine-to-Machine communication with higher data rates and high power densities, the demands on connection technology are continuously increasing,” said Erich Nuncic, CSO of Mobile Devices and Substrates business unit at AT&S. “Our participation into the Electronica China has clearly demonstrated that AT&S has worked closely with its customers to deliver the necessary innovative solutions with leading edge technologies. A close cooperation already during the design and development phase and later on in mass production meet the needs of our world-class customers.”

As one of Austria’s largest investors in China, AT&S stands for high-tech and innovation in China since 2001. The company has the most advanced high-tech facility and process for mass production of high-end IC substrates and HDIs in both Shanghai and Chongqing. AT&S is fully committed to continuously investing in technology and innovation for semiconductors and microelectronics industry in China and contributing to the development of high-end and value-added manufacturing industry.

AT&S is the European market leader and one of the globally leading manufacturers of high-end printed circuit boards and IC substrates. AT&S industrialises leading-edge technologies for its core business segments Mobile Devices, Automotive, Industrial and Medical. As an international growth enterprise, AT&S has a global presence with production sites in Austria (Leoben, Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan near Seoul).

Press contacts
Gerda Königstorfer
Director Investor Relations & Communications
Tel: +43 3842 200 5925; Mobile +43 676 8955 5925
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Korie Jiang
Corporate Affair & Communications Director
AT&S (China) Co., Ltd.
Tel: +86 21 2408 0108
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