AT&S and EPCOS cooperate on embedding components

Published On: July 10, 20131.4 min read287 words

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) is collaborating with EPCOS, a TDK Group Company, on developing technologies for embedding active and passive electronic components. The aims of the partnership include driving forward standardisation of these technologies, which play a decisive role in the fabrication of extremely miniaturised modules.

AT&S and EPCOS will enable smartphone and tablet PC manufacturers significantly improved access to space-saving integration technologies. These offer several advantages: embedding semiconductors and other electronic components in printed circuit boards or other module substrates supports the integration of numerous mobile device functions in an extremely small space, improves overall performance and extends battery life.


About AT&S

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) is European market leader and one of the world’s leading producers of high-end printed circuit boards. AT&S is especially well positioned worldwide in the highest tech market segment for HDI microvia printed circuit boards, which are chiefly used in mobile devices. The Group is also highly successful in the automotive printed circuit board market, and in the industrial and medical technology sectors. In 2013 AT&S set the next logical step in its high-tech strategy and entered the IC-substrate market in cooperation with a leading semiconductor manufacturer. As an international growth enterprise AT&S has a global presence, with three production facilities in Austria (Leoben, Fehring, Klagenfurt) and one each in India (Nanjangud), China (Shanghai) and Korea (Ansan, near Seoul). It currently employs some 7,300 people.

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Press contact

Christina Schuller, Head of Corporate Communications

AT&S Austria Technologie & Systemtechnik AG

+43 (0)3842 200-5908,,