ECP vs. Existing Packaging Concepts

ECP® is highly competitive

 ECPIMBFan-out WLPPopBGA/LGALead-Frame (QFP, TSCP, ...)QFNWL-CSP
ECPIMBFan-out WLPPopBGA/LGALead-Frame (QFP, TSCP, ...)QFNWL-CSP
CSP footprintAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECP
Low thicknessAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECP
3D routing (front to back of IC)AT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECP
Large pitch redistribution (no RDL)AT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECP
Fanout areaAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECP
Backside protectionAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECP
3D stacking in packageAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECP
3D stacking of packaged ICsAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECP
IC + discrete integrationAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECP
Production ReadinessAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECPAT&S ECP

ECP® is highly competitive in comparision to existing packaging types and enables future applications through advanced 3D packaging capabilities.

Learn more