HIGH PERFORMANCE IC SUBSTRATES
IC SUBSTRATES
AT&S is leading the industry in high yielding advanced interconnect solutions. State-of-the-art capacities, reliable production processes and innovative IC Substrate technologies available from multiple locations to address industry’s needs across a wide range of applications.
In this whitepaper, learn how AT&S has further expended IC Substrates capabilities, aligning to the market trends and addressing the needs of a wide range of growing applications.
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Address your high-performance application needs with IC substrates from AT&S for flip-chip technologies.
Digitalization has been moving forward with tremendous pace in the last decade and was greatly accelerated by the pandemic. At the same time, new applications emerged and the data traffic and processing needs have significantly increased, driving further the demands for high performance computing, storage, networking, connectivity and sensing devices, cloud and edge computing, Â and artificial intelligence, and the infrastructure required to support them.
IC substrates are essential to produce more complex IC designs. Challenged with scarcity in supply, the forecast for production of substrates looks grim while demand rises exponentially.
Advanced manufacturing capabilities
High performance, best in class yields across several applications, including large body sizes & multiple layers.
Strong customer focus & partner collaboration
AT&S works with top-tier customers in the market today with great reputations.
Innovative technologies & programs
Featuring Embedded Cavity,
Multi-Core, and
Fan Out Panel Level Packaging (FOPLP) applications.
Server
Data Center
HPC
Storage IC
Client
Gaming
Networking
Communications
Automotive
Edge and IoT
- Advanced manufacturing capabilities
- Flexibility and adaptability to the needs of our customers
- Innovative technologies & programs
- State-of-the-art operations
- Supply chain stability
- Multiple locations: China, Austria, Malaysia
- Design and simulation services
- R&D collaboration
- Pathfinding activities, joint development programs
- Capacity reservations
- Awarded customer support
- Dedicated regional support
HINTERBERG, AUSTRIA
First European IC substrate R&D & production center.
CHONGQING, CHINA
Solid production record since 2016 and scaling up.
KULIM, MALAYSIA
New campus and location with the capacity for expansion.