HIGH PERFORMANCE IC SUBSTRATES
IC SUBSTRATES
AT&S is leading the industry in high yielding advanced interconnect solutions. State-of-the-art capacities, reliable production processes and innovative IC Substrate technologies available from multiple locations to address industry’s needs across a wide range of applications.
In this whitepaper, learn how AT&S has further expended IC Substrates capabilities, aligning to the market trends and addressing the needs of a wide range of growing applications.
![ATS_Whitepaper_IC-Substrates-2023-web_Page-1 IC substrates whitepaper preview](https://ats.net/wp-content/uploads/ATS_Whitepaper_IC-Substrates-2023-web_Page-1-400x565.png)
DOWNLOAD WHITEPAPER
Complete the form below to access the IC substrates whitepaper.
Address your high-performance application needs with IC substrates from AT&S for flip-chip technologies.
Digitalization has been moving forward with tremendous pace in the last decade and was greatly accelerated by the pandemic. At the same time, new applications emerged and the data traffic and processing needs have significantly increased, driving further the demands for high performance computing, storage, networking, connectivity and sensing devices, cloud and edge computing, Â and artificial intelligence, and the infrastructure required to support them.
IC substrates are essential to produce more complex IC designs. Challenged with scarcity in supply, the forecast for production of substrates looks grim while demand rises exponentially.
Advanced manufacturing capabilities
![advanced-manufacturing-ic-substrates Advanced manufacturing IC substrates](https://ats.net/wp-content/uploads/advanced-manufacturing-ic-substrates-400x400.jpg)
High performance, best in class yields across several applications, including large body sizes & multiple layers.
Strong customer focus & partner collaboration
![customer-focus-ic-substrates Customer focus](https://ats.net/wp-content/uploads/customer-focus-ic-substrates-400x400.jpg)
AT&S works with top-tier customers in the market today with great reputations.
Innovative technologies & programs
![innovation-tech-ic-substrates Innovative technologies & programs](https://ats.net/wp-content/uploads/innovation-tech-ic-substrates-400x400.jpg)
Featuring Embedded Cavity,
Multi-Core, and
Fan Out Panel Level Packaging (FOPLP) applications.
![ICON_5GSemiconductorChipset](https://ats.net/wp-content/uploads/ICON_5GSemiconductorChipset.png)
Server
Data Center
HPC
![ICON_Server](https://ats.net/wp-content/uploads/ICON_Server.png)
Storage IC
![ICON_Laptop](https://ats.net/wp-content/uploads/ICON_Laptop.png)
Client
Gaming
![ICON_5GDataCentersEdgeCloud](https://ats.net/wp-content/uploads/ICON_5GDataCentersEdgeCloud.png)
Networking
Communications
![ICON_AutomotiveADAS](https://ats.net/wp-content/uploads/ICON_AutomotiveADAS-400x400.png)
Automotive
![ICON_AI1 Edge AI -IoT icon](https://ats.net/wp-content/uploads/ICON_AI1-400x400.png)
Edge and IoT
- Advanced manufacturing capabilities
- Flexibility and adaptability to the needs of our customers
- Innovative technologies & programs
- State-of-the-art operations
- Supply chain stability
- Multiple locations: China, Austria, Malaysia
- Design and simulation services
- R&D collaboration
- Pathfinding activities, joint development programs
- Capacity reservations
- Awarded customer support
- Dedicated regional support
HINTERBERG, AUSTRIA
![htb-ic-substrates AT&S Hinterberg Austria](https://ats.net/wp-content/uploads/htb-ic-substrates-400x400.jpg)
First European IC substrate R&D & production center.
CHONGQING, CHINA
![chongqing-ic-substrates AT&S Chongqing, China](https://ats.net/wp-content/uploads/chongqing-ic-substrates-400x400.jpg)
Solid production record since 2016 and scaling up.
KULIM, MALAYSIA
![kulim-ic-substrates AT&S Kulim, Malaysia](https://ats.net/wp-content/uploads/kulim-ic-substrates-400x400.jpg)
New campus and location with the capacity for expansion.