产品信息
- 材料中心为金属基（铝或铜）
- 主要为双层PTH板
- 采用特殊设计规则，实现最佳热分布
- 用于汽车、LED应用
技术数据单
| Capabilities | Standard Production | Advanced Production |
|---|---|---|
| Layer Count / Technology | 2 Layer PTH | 2 Layer PTH |
| PCB Thickness Range | 0,5 - 2,4 mm | 0,1 - 3,2 mm |
| Materials | FR4 / FR4 halogen reduced | FR4 / Taconic / Rogers / |
| Glass Transition Temperature | 105°C / 140°C / 170°C | 105°C / 140°C / 170°C |
| Copper thickness | 18µm / 35µm / 70µm / 105µm / 140µm | 9µm / 18µm / 35µm / 70µm / 105µm / 140µm |
| Copper Plating Holes | 20 µm ( 25 µm ) | 13 µm / 20 µm / 25 µm |
| Min. Line / Spacing | 100µm / 100µm | 50µm / 50µm |
| Soldermask Registration | +/- 100 µm ( Photoimageable ) | +/- 50 µm ( Photoimageable ) |
| Min. Soldermask Dam | 100 µm | 65 µm |
| Soldermask Color | green / white / black / red / blue | green / white / black / red / blue |
| Max. PCB Size | 580 mm x 500 mm | 580 mm x 500 mm |
| Production Panel | 609,6 mm x 530 mm 609,6 mm x 457,2 mm | 609,6 mm x 530 mm 609,6 mm x 457,2 mm |
| Min. Annular Ring | 150 µm | 0 µm |
| smallest drill | 0,28 mm | 0,2 mm |
| smalles Routing bit | 0,8 mm | 0,8 mm |
| Surfaces | OSP / HAL Lead Free / Immersion Tin Immersion NI/AU Plated Ni/Au | OSP / HAL Lead Free / Immersion Tin Immersion NI/AU Plated Ni/Au |
| Scoring | Yes | Yes |
| ID print | White | White |
| Blue Mask & Carbon print | Yes | Yes |