刚挠结合PCB产品

产品信息

  • 聚酰亚胺与FR4材料组合
  • PCB具有刚性区与挠性区,层数减少
  • 刚性PCB连接无需电缆及连接器,可实现更好的信号传递。
  • 用于汽车、摄像系统(正面及背面)、雨量传感器、传感器

技术数据单

CapabilitiesStandard ProductionAdvanced Production
Layer Count / Technology2 layer - 10 Layer2 layer - 12 Layer
PCB Thickness Range75µm - 1600µm50µm - 2000µm
Materials Polyimide / FR4Polyimide / FR4
Thinnest Core50µm without adhesive25 µm without adhesive
Copper thickness9µm / 12µm / 18 µm / 35µm9µm / 12µm / 18 µm / 35µm
Copper Plating Holes20 µm (25 µm)13 µm / 20 µm / 25 µm
Min. Line / Spacing125µm / 125µm65µm / 65µm ( LDI )
Soldermask Registration+/- 100 µm (Photoimageable)+/- 50 µm (Photoimageable)
Min. Soldermask Dam100 µm65 µm
Soldermask Coloramber (green)amber (green)
Cover Layer Polyimidelaser cutting / punching / drilledlaser cutting / punching / drilled
Production Panel609,6 mm x 457,2 mm
250 mm x (250 - 410 mm)
609,6 mm x 457,2 mm
250 mm x (250 - 410 mm)
Min. Annular Ring150 µm150 µm
smallest drill0,28 mm0,2 mm
smalles Routing bit0,8 mm0,8 mm
SurfacesOSP / Immersion Tin
Immersion NI/AU
Plated Ni/Au
OSP/ Immersion Tin
Immersion NI/AU
Plated Ni/Au
ID printWhiteWhite
Adhesive TapeYesYes
SMT ServiceYesYes
Stiffner materialFR4 / Steel / AluminiumFR4 / Steel / Aluminium