产品信息
- 聚酰亚胺与FR4材料组合
- PCB具有刚性区与挠性区，层数减少
- 刚性PCB连接无需电缆及连接器，可实现更好的信号传递。
- 用于汽车、摄像系统（正面及背面）、雨量传感器、传感器
技术数据单
| Capabilities | Standard Production | Advanced Production |
|---|---|---|
| Layer Count / Technology | 2 layer - 10 Layer | 2 layer - 12 Layer |
| PCB Thickness Range | 75µm - 1600µm | 50µm - 2000µm |
| Materials | Polyimide / FR4 | Polyimide / FR4 |
| Thinnest Core | 50µm without adhesive | 25 µm without adhesive |
| Copper thickness | 9µm / 12µm / 18 µm / 35µm | 9µm / 12µm / 18 µm / 35µm |
| Copper Plating Holes | 20 µm (25 µm) | 13 µm / 20 µm / 25 µm |
| Min. Line / Spacing | 125µm / 125µm | 65µm / 65µm ( LDI ) |
| Soldermask Registration | +/- 100 µm (Photoimageable) | +/- 50 µm (Photoimageable) |
| Min. Soldermask Dam | 100 µm | 65 µm |
| Soldermask Color | amber (green) | amber (green) |
| Cover Layer Polyimide | laser cutting / punching / drilled | laser cutting / punching / drilled |
| Production Panel | 609,6 mm x 457,2 mm 250 mm x (250 - 410 mm) | 609,6 mm x 457,2 mm 250 mm x (250 - 410 mm) |
| Min. Annular Ring | 150 µm | 150 µm |
| smallest drill | 0,28 mm | 0,2 mm |
| smalles Routing bit | 0,8 mm | 0,8 mm |
| Surfaces | OSP / Immersion Tin Immersion NI/AU Plated Ni/Au | OSP/ Immersion Tin Immersion NI/AU Plated Ni/Au |
| ID print | White | White |
| Adhesive Tape | Yes | Yes |
| SMT Service | Yes | Yes |
| Stiffner material | FR4 / Steel / Aluminium | FR4 / Steel / Aluminium |