半挠性PCB产品

产品信息

半挠性PCB产品

  • 该技术采用薄型双面FR4材料(125µm电介质)
  • 5mm弯曲半径条件下,耐折次数多达五次
  • 成本效益屈曲安装解决方案
  • 用于汽车、控制器、电缆替代、LED

技术数据单

CapabilitiesStandard ProductionAdvanced Production
Layer Count / Technology2 Layer PTH2 Layer PTH
PCB Thickness Range0,15 mm - 0,18 mm0,15 mm - 0,18 mm
Materials FR4 (125µm Dielectric)FR4 (125µm Dielectric)
Glass Transition Temperature105°C / 140°C105°C / 140°C
Copper thickness18µm / 35µm / 70µm18µm / 35µm / 70µm
Copper Plating Holes20 µm 13 µm / 20 µm
Min. Line / Spacing100µm / 100µm50µm / 50µm
Soldermask Registration+/- 150 µm Screen print+/- 100 µm (Photoimageable)
Min. Soldermask Dam150 µm100 µm
Soldermask Colorgreengreen
Max. PCB Size580 mm x 500 mm580 mm x 500 mm
Production Panel609,6 mm x 530 mm
609,6 mm x 457,2 mm
609,6 mm x 530 mm
609,6 mm x 457,2 mm
Min. Annular Ring150 µm0 µm
smallest drill0,28 mm0,2 mm
smalles Routing bit0,8 mm0,8 mm
SurfacesOSP / Immersion Tin
Immersion NI/AU
Plated Ni/Au
OSP / Immersion Tin
Immersion NI/AU
Plated Ni/Au
ScoringYesYes
ID printWhiteWhite
Blue Mask & Carbon printYesYes