高密度互连微孔PCB产品

产品信息

  • 交错与堆叠式铜填充激光通孔,配埋孔
  • 每面高达20层,5层为高密度互连积层
  • 无卤素基材料 (中等至高等TG)
  • 镀边技术,保护空间优化与组装

技术数据单

CapabilitiesStandard ProductionAdvanced Production
Layer Count / Technology4 - 20 Layers4 - 20 Layers
PCB Thickness Range0,5 - 2,4 mm0,32 - 2,4 mm
Build up Technology 1-N-1 / 2-N-2 /3-N-3/4-N-41-N-1 / 2-N-2 /3-N-3/4-N-4/5-N-5
Min. Laser drill Diameter110 µm80 µm
Laser TechnologyCO2 direct drilling (UV/CO2)CO2 direct drilling (UV/CO2)
Materials FR4 / FR4 halogen reducedFR4 / Taconic / Rogers / others on request
Glass Transition Temperature105°C / 140°C / 170°C105°C / 140°C / 170°C
Standard glass cloth106 / 1080 / 2116 / 1501 /76281037 / 106 / 1080 / 2116 / 1501 / 7628
Copper thickness12 µm / 18µm / 35µm / 70µm9µm / 12µm / 18µm / 35µm / 70µm / 105µm
Copper Plating Holes20 µm (25 µm)13 µm / 20 µm / 25 µm
Min. Line / Spacing75µm / 75µm50µm / 50µm
Soldermask Registration+/- 38 µm (Photoimageable)+/- 25 µm (Photoimageable)
Min. Soldermask Dam70 µm60 µm
Soldermask Colorgreen / white / black / red / bluegreen / white / black / red / blue
Max. PCB Size575 mm x 500 mm575 mm x 500 mm
Production Panel609,6 mm x 530 mm
609,6 mm x 457,2 mm
609,6 mm x 530 mm
609,6 mm x 457,2 mm
Min. Annular Ring125 µm100 µm
smallest drill0,28 mm0,15 mm
smalles Routing bit0,8 mm0,8 mm
SurfacesOSP / HAL Lead Free / Immersion Tin
Immersion NI/AU
Plated Ni/Au
Immersion Ag
OSP / HAL Lead Free / Immersion Tin
Immersion NI/AU
Plated Ni/Au
Immersion Ag
ScoringYesYes
ID printWhiteWhite
Blue Mask & Carbon printYesYes