产品信息
- 所有层为交错与堆叠式铜填充激光通孔
- 每面高达14层，6层为高密度互连积层
- 无卤素基材料 (中等至高等TG)
- 镀边技术，保护空间优化与组装
技术数据单
| Capabilities | Standard Production | Advanced Production |
|---|---|---|
| Layer Count / Technology | 4 - 12 Layers | 4 - 14 Layers |
| PCB Thickness Range | 0,3- 1,2 mm | 0,3 - 1,4 mm |
| Build up Technology | ANY LAYER Microvias copper filled | ANY LAYER Microvias copper filled |
| Min. Laser drill Diameter | 110 µm | 80 µm |
| Laser Technology | CO2 direct drilling (UV/CO2) | CO2 direct drilling (UV/CO2) |
| Materials | FR4 / FR4 halogen reduced | FR4 / FR4 halogen reduced |
| Glass Transition Temperature | 105°C / 140°C / 170°C | 105°C / 140°C / 170°C |
| Standard glass cloth | 106 / 1080 / 2116 / 1501 / 7628 | 1037 / 106 / 1080 / 2116 / 1501 / 7628 |
| Copper thickness | 12 µm / 18µm | 9µm / 12µm / 18µm |
| Copper Plating Holes | 20 µm (25 µm) | 13 µm / 20 µm / 25 µm |
| Min. Line / Spacing | 75µm / 75µm | 50µm / 50µm |
| Soldermask Registration | +/- 38 µm (Photoimageable) | +/- 25 µm (Photoimageable) |
| Min. Soldermask Dam | 70 µm | 60 µm |
| Soldermask Color | green / white / black / red / blue | green / white / black / red / blue |
| Max. PCB Size | 575 mm x 500 mm | 575 mm x 500 mm |
| Production Panel | 609,6 mm x 530 mm 609,6 mm x 457,2 mm | 609,6 mm x 530 mm 609,6 mm x 457,2 mm |
| Min. Annular Ring | 125 µm | 100 µm |
| smallest drill | 0,28 mm | 0,15 mm |
| smalles Routing bit | 0,8 mm | 0,8 mm |
| Surfaces | OSP / HAL Lead Free / Immersion Tin Immersion NI/AU Plated Ni/Au Immersion Ag | OSP / HAL Lead Free / Immersion Tin Immersion NI/AU Plated Ni/Au Immersion Ag |
| Scoring | Yes | Yes |
| ID print | White | White |
| Blue Mask & Carbon print | Yes | Yes |