产品信息
- 采用特殊树脂类材料制成，具有低频及低损耗的特点
- 由FR4与低损材料混合构建
- 严格的阻抗控制
- 用于汽车、雷达、CAR与CAR通讯、远程协助、主动驱动系统
技术数据单
| Capabilities | Standard Production | Advanced Production |
|---|---|---|
| Layer Count / Technology | 4 - 28 Layers | 4 - 28 Layers |
| PCB Thickness Range | 0,5 - 2,4 mm | 0,32 - 2,4 mm |
| Build up | Core & Hybrid Build up | Core & Hybrid Build up |
| Materials | FR4 / Rogers / Taconic / others (Teflon based) | FR4 / Taconic / Rogers / others on request |
| Glass Transition Temperature | 105°C / 140°C / 170°C | 105°C / 140°C / 170°C |
| Standard glass cloth | 106 / 1080 / 2116 / 1501 / 7628 | 1037 / 106 / 1080 / 2116 / 1501 / 7628 |
| Copper thickness | 18µm / 35µm/ 70µm | 9µm / 18µm / 35µm / 70µm |
| Copper Plating Holes | 20 µm (25 µm) | 13 µm / 20 µm / 25 µm |
| Min. Line / Spacing | 100µm / 100µm | 50µm / 50µm |
| Soldermask Registration | +/- 65 µm (Photoimageable) | +/- 25 µm (Photoimageable) |
| Min. Soldermask Dam | 75 µm | 60 µm |
| Soldermask Color | green / white / black / red / blue | green / white / black / red / blue |
| Max. PCB Size | 575 mm x 500 mm | 575 mm x 500 mm |
| Production Panel | 609,6 mm x 530 mm 609,6 mm x 457,2 mm | 609,6 mm x 530 mm 609,6 mm x 457,2 mm |
| Min. Annular Ring | 150 µm | 100 µm |
| smallest drill | 0,28 mm | 0,15 mm |
| smalles Routing bit | 0,8 mm | 0,8 mm |
| Surfaces | OSP / HAL Lead Free / Immersion Tin Immersion NI/AU Plated Ni/Au Immersion Ag | OSP / HAL Lead Free / Immersion Tin Immersion NI/AU Plated Ni/Au Immersion Ag |
| Scoring | Yes | Yes |
| ID print | White | White |
| Blue Mask & Carbon print | Yes | Yes |