高频 /低损耗PCB产品

产品信息

  • 采用特殊树脂类材料制成,具有低频及低损耗的特点
  • 由FR4与低损材料混合构建
  • 严格的阻抗控制
  • 用于汽车、雷达、CAR与CAR通讯、远程协助、主动驱动系统

技术数据单

CapabilitiesStandard ProductionAdvanced Production
Layer Count / Technology4 - 28 Layers4 - 28 Layers
PCB Thickness Range0,5 - 2,4 mm0,32 - 2,4 mm
Build upCore & Hybrid Build upCore & Hybrid Build up
Materials FR4 / Rogers / Taconic / others (Teflon based)FR4 / Taconic / Rogers / others on request
Glass Transition Temperature105°C / 140°C / 170°C105°C / 140°C / 170°C
Standard glass cloth106 / 1080 / 2116 / 1501 / 76281037 / 106 / 1080 / 2116 / 1501 / 7628
Copper thickness18µm / 35µm/ 70µm9µm / 18µm / 35µm / 70µm
Copper Plating Holes20 µm (25 µm)13 µm / 20 µm / 25 µm
Min. Line / Spacing100µm / 100µm50µm / 50µm
Soldermask Registration+/- 65 µm (Photoimageable)+/- 25 µm (Photoimageable)
Min. Soldermask Dam75 µm60 µm
Soldermask Colorgreen / white / black / red / bluegreen / white / black / red / blue
Max. PCB Size575 mm x 500 mm575 mm x 500 mm
Production Panel609,6 mm x 530 mm
609,6 mm x 457,2 mm
609,6 mm x 530 mm
609,6 mm x 457,2 mm
Min. Annular Ring150 µm100 µm
smallest drill0,28 mm0,15 mm
smalles Routing bit0,8 mm0,8 mm
SurfacesOSP / HAL Lead Free / Immersion Tin
Immersion NI/AU
Plated Ni/Au
Immersion Ag
OSP / HAL Lead Free / Immersion Tin
Immersion NI/AU
Plated Ni/Au
Immersion Ag
ScoringYesYes
ID printWhiteWhite
Blue Mask & Carbon printYesYes