厚铜PCB产品

产品信息

  • 铜厚度 70µm / 105µm / 140µm / 210µm
  • 产品范围4~8层
  • 中/高TG材料
  • 用于汽车、大电流电路、散热、电力控制、电力分配、电动汽车电池管理、混合动力汽车中央电气系统

技术数据单

CapabilitiesStandard ProductionAdvanced Production
Layer Count / Technology2 - 10 Layers2 - 10 Layers
PCB Thickness Range0,5 - 2,4 mm0,5 - 2,4 mm
Materials FR4 / FR4 halogen reducedFR4 / FR4 halogen reduced
Glass Transition Temperature105°C / 140°C / 170°C105°C / 140°C / 170°C
Standard glass cloth106 / 1080 / 2116 / 1501 / 76281037 / 106 / 1080 / 2116 / 1501 / 7628
Copper thickness70µm / 105µm / 140µm / 210µm70µm / 105µm / 140µm / 210µm
Copper Plating Holes20 µm ( 25 µm )20 µm / 25 µm
Min. Line / Spacing250µm / 250µm200µm / 200µm
Soldermask Registration+/- 75 µm (Photoimageable)+/- 65 µm (Photoimageable)
Min. Soldermask Dam100 µm75 µm
Soldermask Colorgreen / white / black / red / bluegreen / white / black / red / blue
Max. PCB Size575 mm x 500 mm575 mm x 500 mm
Production Panel609,6 mm x 530 mm
609,6 mm x 457,2 mm
609,6 mm x 530 mm
609,6 mm x 457,2 mm
Min. Annular Ring150 µm100 µm
smallest drill0,4 mm0,28mm
smalles Routing bit0,8 mm0,8 mm
SurfacesOSP / HAL Lead Free / Immersion Tin
Immersion NI/AU
Plated Ni/Au
Immersion Ag
OSP / HAL Lead Free / Immersion Tin
Immersion NI/AU
Plated Ni/Au
Immersion Ag
ScoringYesYes
ID printWhiteWhite
Blue Mask & Carbon printYesYes