奥地利科技与系统技术股份公司（AT&S）简称奥特斯，是欧洲以及全球领先的高端印制电路板制造商。集团致力于生产具有前瞻性技术的产品， 并将工业领域的核心市场定位于：移动设备、汽车和航天、工业电子、医疗与健康以及先进封装领域。2013年集团迈出了其高科技战略的下一步行动，与全球领 先的半导体生产商合作开发半导体封装载板。作为一家飞速发展的跨国公司，AT&S 分别在奥地利（利奥本、菲岭）、印度（南燕古德）、中国（上海、重庆在建）和韩国（安山）拥有生产基地。目前集团拥有员工约8000人。更多资讯，请浏览公司网站www.ats.net。
Elke Koch, 投资者关系&传播总监
奥地利 利奥本 8700
电话：+43 3842 200-5925;
手机：+43 676 8955 5925;
- AT&S positions itself for the next technology generation in its high-end PCB core business
- Total investments at the Chongqing plant will be increased from EUR 350 million to roughly EUR 480 million by 2017
- Ramp-up of the substrate plant currently undergoing qualification in Chongqing still scheduled for 2016
AT&S is one of the globally leading manufacturers of high-end HDI and any-layer printed circuit boards (PCBs). Key trends in this industry include the ongoing miniaturisation and increasing modularisation. As a result of this development, high-end PCB technologies merge faster and faster with the technologies required by the semi-conductor
In addition to the entry into the IC substrate business, which is currently in its start-up phase, this opens up significant new potential for AT&S to position itself for this next technology generation in the core business at an early stage.
To maintain the long-term and sustainable profitable growth in the high-end sector, AT&S will explore this market potential by building new capacities for this next generation of PCBs, so-called substrate-like PCBs. With the consent of the Supervisory Board, the Management Board has decided the required investments at the Chongqing site. The
planned investment volume will consequently increase from EUR 350 million to some EUR 480 million by mid-2017.
The start of production for this technology is expected for the second half of the calendar year 2016 and is based on a close cooperation between the two AT&S sites in Shanghai and Chongqing. Synergies will be leveraged above all in the areas of technology, process know-how and management capacities: technology development of substrate-like PCBs
initially takes place in Shanghai plant with first quantities produced already in calendar year 2015. High volume mass production of SLPs expected to start second half of calendar year 2016 at new plant in Chongqing.
The additional investments required will be financed through improved cash flow and using existing credit facilities. The ramp-up of the substrate plant in Chongqing, which is currently undergoing qualification, is expected as planned with the first revenues in the calendar year 2016.
AT & S Austria Technologie & Systemtechnik AG – first choice for advanced applications
AT&S is the European market leader and one of the globally leading manufacturers of high-value printed circuit boards. AT&S industrialises leading-edge technologies for its core business segments Mobile Devices, Automotive, Industrial, Medical. In 2013, AT&S took the next logical step in the high-tech strategy by entering the IC substrate business through a collaboration agreement with a leading global semiconductor manufacturer. As an international growth enterprise, AT&S has a global presence, with production facilities in Austria (Leoben and Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing under construction) and Korea (Ansan, near Seoul). The company currently employs about 8,000 people. For more information www.ats.net
Elke Koch, Director Investor Relations & Communications
AT & S Austria Technologie & Systemtechnik AG, 8700 Leoben/Austria
Tel: +43 3842 200-5925; Mobile: +43 676 8955 5925; firstname.lastname@example.org, www.ats.net