Embedded Component Packaging from AT&S


ECP® is AT&S’s solution to the next generation miniaturisation demands of high performance applications and products.

Embedding components within an electronic module offers dramatic benefits:

  • Miniaturization through stacking of electronic components
  • Performance Gains due to the close proximity of vital passive components to the active semiconductor device

Products benefitting from ECP® will be, amongst others, high efficiency power modules, integrated wireless modules, media codecs and high signal integrity applications e.g. sensors and amplifiers.

Just as MEMS (Micro Electro-Mechanical System) and IPD (Integrated Passive Device) emerged from standard semiconductor processes, ECP builds on well proven techniques to create this new class of packages.

Major ECP advantages include:

  • Significant form factor reduction through integration
  • High reliability
  • Thermal management
  • Possibility to integrate EMI shielding
  • CTE matching

Hubert Haidinger – Sales Engineering Business Unit Industrial & Automotive



Rainbow Yuan – Director Front-End Engineering

5000, Jin Du Road
Xinzhuang Industry Park
Minhang District
Shanghai 201108
P.R. China

Phone:+86 21 24080 120

Send Rainbow a message