Technologies

Innovation is an important cornerstone of AT&S corporate culture. Through bold investment and many years of research and development, we have developed a whole catalogue of technologies, including some with patents pending. Our state-of-the-art production processes allow us to constantly push the boundaries of what is possible for our customers.

With our mSAP technology,we bring additive processes to the printed circuit board industry for the first time, which combines smaller traces and optimal signal routing. Our 2.5D and embedded component packaging technology platforms bring a new dimension to the miniaturisation of circuits, while our Z-Interconnect technology is setting new standards in bringing printed circuit boards into line with completely different performance requirements. We are constantly developing our technologies and finding ways of using them together to create perfect printed circuit boards and substrates for every application.

Our technologies

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Z-Interconnect technology

Z-Interconnect is a technology developed by AT&S that makes it possible to integrate two or more circuit boards designed for different requirements into one system from a single source.

Z-Interconnect technology
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ECP® technology

Embedding has now emerged as a worthy competitor to traditional packaging technologies for key applications, offering specific and quantifiable benefits in terms of miniaturisation, integration, reliability and performance.

ECP® technology
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2.5D® technology

2.5D® technology from AT&S makes printed circuit boards extremely compact and flexible enough to bend for installation.

2.5D® technology
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mSAP technology

mSAP technology enables the production of printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry.

mSAP technology