Our development activities are focused on our 4 key development areas:
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The core competence of the “Interconnect Density Group” is the development of new technical solutions which enable a down-scaling of the 3D size of the PCBs while increasing their functional complexity.
The main drivers of our activity are new consumer products (Smartphones, Tablets, Notebooks…) for which the market demands smaller and lighter with enhanced functionality. To enable our customers to further drive market trends, we work to continuously reduce the dimensions of the conductive structures (traces and vias) and the thickness of the boards, while introducing new high-density interconnection solutions and increasing the electrical and mechanical performance of the final product.