Product Information “High Frequency / Low Loss PCBs”
- Made of special Resin system material with Low ER and Low loss factor
- Hybrid Build up mix of FR4 with Low loss material
- Tight Impedance control
- Used in Automotive, Radar, CAR to CAR communication, Distance Assistance, Active Drive Systems
Technology Sheet
| Capabilities | Standard Production | Advanced Production |
|---|---|---|
| Layer Count / Technology | 4 - 28 Layers | 4 - 28 Layers |
| PCB Thickness Range | 0.5 - 2.4 mm | 0.32 - 2.4 mm |
| Build Up | Core & Hybrid Build Up | Core & Hybrid Build Up |
| Materials | FR4 / Rogers / Taconic / others (Teflon based) | FR4 / Taconic / Rogers / others on request |
| Glass Transition Temperature | 105°C / 140°C / 170°C | 105°C / 140°C / 170°C |
| Standard Glass Cloth | 106 / 1080 / 2116 / 1501 / 7628 | 1037 / 106 / 1080 / 2116 / 1501 / 7628 |
| Copper Thickness | 18µm / 35µm / 70µm | 9µm / 18µm / 35µm / 70µm |
| Copper Plating Holes | 20µm (25µm) | 13µm / 20µm / 25µm |
| Min. Line / Spacing | 100µm / 100µm | 50µm / 50µm |
| Soldermask Registration | +/- 65µm (Photoimageable) | +/- 25µm (Photoimageable) |
| Min. Soldermask Dam | 75µm | 60µm |
| Soldermask Color | Green / white / black / red / blue | Green / white / black / red / blue |
| Max. PCB Size | 575 mm x 500 mm | 575 mm x 500 mm |
| Production Panel | 609.6 mm x 530 mm 609.6 mm x 457.2 mm | 609.6 mm x 530 mm 609.6 mm x 457.2 mm |
| Min. Annular Ring | 150µm | 100µm |
| Smallest Drill | 0.28 mm | 0.15 mm |
| Smallest Routing Bit | 0.8 mm | 0.8 mm |
| Surfaces | OSP / HAL Lead Free / Immersion Tin Immersion Ni/Au Plated Ni/Au Immersion Ag | OSP / HAL Lead Free / Immersion Tin Immersion Ni/Au Plated Ni/Au Immersion Ag |
| Scoring | Yes | Yes |
| ID Print | White | White |
| Blue Mask & Carbon Print | Yes | Yes |