Product Information “HDI Microvia PCBs”
The history of AT&S has been shaped by high density interconnect (HDI) printed circuit boards. In 1997 they were developed for mass production for the nascent mobile phone industry. Since then HDI printed circuit boards have found applications throughout the electronics industry, and their use was given additional impetus by the introduction of BGA/CSP components. AT&S offers the full range of technologies, from 4-layer laser to 6-n-6 HDI multilayer in all thicknesses.
Special technologies offered by AT&S in connection with HDI:
- Edge plating for shielding and ground connection
- Copper-filled microvias
- Stacked and staggered microvias
- Cavities, countersunk holes or depth milling
- Solder resist in black, blue, green, etc.
- Minimum track width and spacing in mass production around 50μm
- Low-halogen material in standard and high Tg range
- Low-DK Material for Mobile Devices
- All recognised printed circuit board industry surfaces available
Technology Sheet
| Capabilities | Standard Production | Advanced Production |
|---|---|---|
| Layer Count / Technology | 4 - 20 Layers | 4 - 24 Layers |
| PCB Thickness Range | 0.5 - 2.4 mm | 0.32 - 2.4 mm |
| Build Up Technology | 1-N-1 / 2-N-2 / 3-N-3 / 4-N-4 | 1-N-1 / 2-N-2 / 3-N-3 / 4-N-4 / 5-N-5 / 6-N-6 / 7-N-7 |
| Min. Laser Drill Diameter | 110µm | 75µm |
| Laser Technology | CO2 Direct Drilling (UV/CO2) | CO2 Direct Drilling (UV/CO2) |
| Materials | FR4 / FR4 Halogen reduced | FR4 / Taconic / Rogers / Others on Request |
| Glass Transition Temperature | 140°C / 150°C / 170°C | 140°C / 150°C / 170°C / 200°C |
| Standard Glass Cloth | 1027 / 106 / 1080 / 2116 / 1501 /7628 | 1037 / 106 / 1080 / 2116 / 1501 / 7628 / 1027 |
| Copper Thickness | 12µm / 18µm / 35µm / 70µm | 9µm / 12µm / 18µm / 35µm / 70µm / 105µm |
| Copper Plating Holes | 20µm (25µm) | 13µm / 20µm / 25µm |
| Min. Line / Spacing | 60µm / 60µm | 40µm / 40µm |
| Soldermask Registration | +/- 38µm (Photoimageable) | +/- 25µm (Photoimageable) |
| Min. Soldermask Dam | 70µm | 60µm |
| Soldermask Color | Green / white / black / red / blue | Green / white / black / red / blue |
| Max. PCB Size | 575 mm x 500 mm | 575 mm x 500 mm |
| Production Panel | 609,6 mm x 530 mm 609,6 mm x 457,2 mm | 609,6 mm x 530 mm 609,6 mm x 457,2 mm |
| Min. Annular Ring | 125µm | 100µm |
| Smallest Drill | 0.28 mm | 0.15 mm |
| Smallest Routing Bit | 0.8 mm | 0.8 mm |
| Surfaces | OSP / Immersion Tin Immersion NI/Au Plated Ni/Au Immersion Ag | OSP / Immersion Tin Immersion NI/Au Plated Ni/Au Immersion Ag |
| Scoring | Yes | Yes |
| ID Print | White | White |
| Blue Mask & Carbon Print | Yes | Yes |