Product Information “HDI Any-Layer PCBs”
HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, AT&S uses laser-drilled microvias electroplated with copper.
Special technologies used with HDI any-layer printed circuit boards:
- Edge plating for shielding and ground connection
- Minimum track width and spacing in mass production around 40μm
- Stacked microvias (plated copper or filled with conductive paste)
- Cavities, countersunk holes or depth milling
- Solder resist in black, blue, green, etc.
- Low-halogen material in standard and high Tg range
- Low-DK Material for Mobile Devices
- All recognised printed circuit board industry surfaces available
Technology Sheet
| Capabilities | Standard Production | Advanced Production |
|---|---|---|
| Layer Count / Technology | 4 - 12 Layers | 4 - 14 Layers |
| PCB Thickness Range | 0.3- 1.2 mm | 0.3 - 1.4 mm |
| Build up Technology | ANY LAYER Microvias Copper filled | ANY LAYER Microvias Copper filled |
| Min. Laser Drill Diameter | 90µm | 75µm |
| Laser Technology | CO2 Direct Drilling (UV/CO2) | CO2 Direct Drilling (UV/CO2) |
| Materials | FR4 / FR4 Halogen reduced | FR4 / FR4 Halogen reduced |
| Glass Transition Temperature | 140°C / 150°C / 170°C | 140°C / 150°C / 170°C |
| Standard Glass Cloth | 1027 / 106 / 1080 / 2116 / 1501 / 7628 | 1027 / 1037 / 106 / 1080 / 2116 / 1501 / 7628 |
| Copper Thickness | 12µm / 18µm | 9µm / 12µm / 18µm |
| Copper Plating Holes | 20µm (25µm) | 13µm / 20µm / 25µm |
| Min. Line / Spacing | 50µm / 50µm | 40µm / 40µm |
| Soldermask Registration | +/- 38µm (Photoimageable) | +/- 25µm (Photoimageable) |
| Min. Soldermask Dam | 70µm | 60µm |
| Soldermask Color | Green / white / black / red / blue | Green / white / black / red / blue |
| Max. PCB Size | 575 mm x 500 mm | 575 mm x 500 mm |
| Production Panel | 609.6 mm x 530 mm 609.6 mm x 457.2 mm | 609.6 mm x 530 mm 609.6 mm x 457.2 mm |
| Min. Annular Ring | 125µm | 100µm |
| Smallest Drill | 0.28 mm | 0.15 mm |
| Smallest Routing Bit | 0.8 mm | 0.8 mm |
| Surfaces | OSP / Immersion Tin Immersion NI/Au Plated Ni/Au Immersion Ag | OSP / Immersion Tin Immersion NI/Au Plated Ni/Au Immersion Ag |
| Scoring | Yes | Yes |
| ID Print | White | White |
| Blue Mask & Carbon Print | Yes | Yes |