AT&S Logo
  • DE
  • EN
  • 中文
  • Company
    • AT&S History
    • Management Board
    • Supervisory Board
    • AT&S Worldwide
    • Vision & Mission
    • Sustainability
      • Core Topics
      • Sustainability Report
      • REACH
      • Conflict minerals
    • Corporate Governance
      • Articles of Association
      • Reports
      • Rules & Procedures
      • Insider-Rules
      • Directors’ Dealings
      • Business Ethics
      • AT&S We Care – Whistleblowing Platform
    • Business Units
      • Mobile Devices & Substrates
      • Automotive, Industrial, Medical
      • Advanced Packaging
    • Trade Shows & Tech Days
      • Trade Shows
      • Tech Days
        • Upcoming Events
        • Previous Events
    • Certifications
    • The High Technology Experience
      • Registration to High Technology Experience
  • Applications
    • Mobile Devices & Substrates
      • Contact
    • Automotive & Aviation
      • Applications Automotive
        • Environment
        • Safety
        • Information
        • Affordable Cars
      • Applications Aviation
      • Contact
    • Industrial
      • Applications
      • Contact
    • Medical
      • Applications
      • Contact
    • Advanced Packaging
      • Ultra Mobile
      • Automotive
      • Semiconductor
      • Industrial Sensorics
      • Medical
      • About ECP
        • FAQ
        • Process & Materials
        • ECP vs. Existing Packaging Concepts
        • Design Ecosystem
        • Facts & Figures
        • Institutes & Industrial Partners
      • Contact
        • Download Area
        • Team
        • Contactform
  • Products & Technology
    • Product Portfolio
      • Double Sided PTH PCBs
        • Double Sided Standard PCBs
        • Metal Core PCBs
        • Copper Inlay PCBs
      • Multilayer PCBs
        • Multilayer Standard PCBs
        • High Frequency / Low Loss PCBs
        • Thick Copper PCBs
      • HDI Microvia PCBs
      • HDI Any-Layer PCBs
      • Flexible & Rigid Flexible PCBs
        • Flexible PCBs
        • Semiflexible PCBs
        • Rigid – Flexible PCBs
        • Flexible PCBs on Aluminium
        • HDI Rigid Flex PCBs
      • IMS Insulated Metallic Substrate PCBs
      • IC Substrates
      • Contact
    • Technology
      • ECP®
      • 2.5D® Technology Platform
      • HSMtec
    • Research & Development
      • Structure
        • Advanced Concepts
        • Development
        • Technology Management
        • Innovation Management
      • Laboratory
      • Institutes & Industrial Partners
      • Download Centre
      • Idea Portal
        • Fields of interest
        • Send us your idea
        • Terms and Conditions of Use
  • Press
    • Press Releases
      • Archive
    • Press Events
    • Videos
    • Photos
    • Contact
  • Investors
    • Ad-hoc Announcements
      • Archive
    • AT&S Share
      • Basic Information
      • Price Development
      • Total Return Calculator
      • Shareholder Structure
      • Dividend
      • Coverage
      • Treasury Shares
    • Equity Story
    • Creditor Relations
    • Key Figures
    • Download
    • Annual General Meeting
      • 26th Annual General Meeting
      • 25th Annual General Meeting
      • 24th Annual General Meeting
      • 23rd Annual General Meeting
      • 22nd Annual General Meeting
      • 21st Annual General Meeting
      • 20th Annual General Meeting
      • 19th Annual General Meeting
      • 18. Annual General Meeting
      • 17. Annual General Meeting
      • 16. Annual General Meeting
      • 15. Annual General Meeting
      • 14. Annual General Meeting
    • Financial Calendar
    • Order service
    • Contact
  • Suppliers
    • How to become an AT&S supplier
    • What we need
    • Download Centre
    • Supplier Platform Login
    • General Terms and Conditions of Purchase
    • Contact
  • Career
Loading Events

All Events

  • This event has passed.

PCIM Europe

Event Navigation

  • « Press Conference Annual Results 2016/17
  • Record Date Annual General Meeting »
Start:
16 May 2017

End:
18 May 2017

Website:
https://www.mesago.de/en/PCIM/home.htm
City:
Nuremberg, Germany
+ Google Calendar+ iCal Export

Event Navigation

  • « Press Conference Annual Results 2016/17
  • Record Date Annual General Meeting »
AT&S Logo
  • Home
  • Imprint
  • General Terms and Conditions
  • Terms of Use
  • Privacy Statement
  • Contact
  • Sitemap
  • Print

© 2021 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft