SiP: Concentrated functionality in the smallest of spaces
AT&S’s “System in a Package” (SiP) concept is based on 15 years of experience in developing new processes and embedding microchips and passive components in our printed circuit boards and IC substrates. New technologies such as Z-Interconnect or substrate-like PCBs make it possible to integrate complete systems such as the cameras in a smartphone into a single module, thus saving valuable space. The component integration of microchips directly into IC substrates and PCBs has also been a key driver of the information technology revolution over the past 20 years: The smartphones we carry in our pockets are compressed computers. To fit so much complex technology into so little space, engineers had to find new solutions. By embedding microchips and other components directly into the circuits, integrated modules have gradually emerged that bundle all required functions into a single, tiny System in Package.
SIPs by AT&S represent the next step in the miniaturization of electronic systems: less space required, more functionality.
Benefits of System in Package
- Minimal losses due to short signal paths
- Optimal heat dissipation
- Lower power consumption
More space, lower power consumption
Embedding microchips makes it possible to keep the signal lines as short as possible, which significantly reduces electrical losses. This advanced embedding can reduce the power consumption of a system by up to 5 percent. This makes it possible, for example, to create systems for controlling the power supply of AI data centers that require significantly less energy to achieve the same computing power. Embedding is also an interesting way to reduce space requirements, weight and energy consumption for medical devices such as pacemakers or power supplies for various systems in electric cars and industry. System in Package solutions enable efficient and sustainable systems even when available space is limited.
The compact design of the SIPs allows very short signal paths, which ensures that losses during transmission are minimal. This enables higher data rates and bandwidths in modern communication systems such as 5G or in radar sensors and makes it easier to optimize thermal management. The exceptional mechanical stability of the systems protects components and contacts and ensures long-lasting performance even under adverse conditions.
SiP continues to drive development
Our customers’ demands will continue to increase in the coming years and our System in Packages ensure that we are able to actively shape the next evolutionary steps in the areas of miniaturization and component integration. New products such as smartwatches or fitness trackers offer even less space for electronics than smartphones and require new approaches to realize new functions in the smallest of spaces. SiPs can feature several specialized chips on a single, highly miniaturized circuit board, so that the entire system of a smartwatch can live inside a single package. The same applies to wireless headphones, medical implants or radio cells for the next generation of wireless data networks. SiPs compress complex systems for maximum efficiency, minimum energy consumption and optimal heat management.
Robust technology
AT&S produces SiPs in Europe and Asia in a highly automated, sophisticated process. Production is extremely efficient, and the products meet the highest standards. Our SiPs are even robust enough to withstand the harsh conditions in space.
In satellites, they can take over the complex control of communication with the earth’s surface, drastically reducing the size and weight of the satellites. This means that four satellites fit inside a single rocket, whereas previously there was only room for one. SiP allows engineers significantly more flexibility when designing circuits and systems. Our experts help our customers to implement their ideas and requirements as efficiently as possible.
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