SLP & HDI: We are pushing the boundaries of miniaturization

Our High Density Interconnect (HDI) and Substrate Like PCBs (SLP) represent the latest evolutionary stage in the field of highly miniaturized electronic systems. When complex circuits are realized in the smallest of spaces, these technologies offer the possibility of integrating a plethora of different functions in a single, reliable module. Whether in wireless in-ear headphones, action cams or communication modules for Bluetooth and wireless networks, our SLP and HDI PCBs pack more functionality into less space. This reduces energy requirements through lower losses, saves valuable raw materials and improves the dissipation of unwanted heat.




SLPs and HDIs by AT&S make it possible to miniaturize the structures on PCBs even further and to reduce space requirements and power consumption.

Benefits of SLP and HDI

  • Very space-saving
  • Low signal loss and reduced power consumption
  • Faster data transmission

mSAP: A key enabler for advanced miniaturization

The modified semi-additive process (mSAP) creates ultra-fine conductive paths by adding copper only where necessary. This saves space, improves signal quality, and boosts performance.

Everything gets smaller

Today, our SLPs allow a space reduction of up to 30 percent and are already moving towards the parameters that are common in the semiconductor industry in terms of circuit size and density. The conductor tracks on our SLPs are now between 12 and 50 micrometers wide and our experts are already working hard to push these limits even further downwards. This development is necessary to keep up with the ongoing miniaturization efforts in the semiconductor industry, which has to supply billions of microscopic transistors with data and energy in powerful microchips for smartphones or AI data centers.

With technical advancements such as embedded trace substrates and coreless PCBs, AT&S is able to respond flexibly to the next wave of miniaturization. Embedded Trace Substrates are conductor tracks that are embedded in the surface of IC substrates or printed circuit boards, making circuits three times smaller and denser and further minimizing electrical losses. Coreless PCBs are printed circuit boards whose design deviates from the traditional structure. This allows thinner PCBs with an uneven number of layers to be produced. These are used to create foldable smartphones, for example.

HDI PCBs: High density for modern electronics

High density interconnect PCBs enable tiny form factors for devices such as cell phones or digital cameras thanks to their high circuit density and small structures.

Increasing efficiency

SLPs will be crucial for the next upgrade to our digital infrastructure. Their unprecedented level of miniaturization opens up new possibilities for product designers, such as foldable devices. The low losses and improved heat dissipation are an important issue in the power supply of data centers and the combination with embedded components and other AT&S technologies such as mSAP enables powerful communication modules that herald the next speed boost in data transmission in smartphones and mobile networks.

AT&S reliably delivers the highest quality anywhere in the world. Our dense network of state-of-the-art production facilities in Asia and Europe is unique and gives our customers the greatest possible flexibility. With our highly miniaturized circuits, we create space for your new ideas. Our experts help our customers to implement their ideas and requirements as efficiently as possible.

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If you would like to learn more about our exciting products, technologies and solutions, our experts are always happy to help.

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