Power Packaging: High current in small spaces
Power packaging technology from AT&S uses new materials with improved electronic properties and state-of-the-art embedding technology to develop high-performance integrated circuits that shape electrical current to power high-tech products such as e-cars or modern server farms more efficiently. We can integrate multiple chips in a package that takes up significantly less space compared to conventional technology. Signal paths are shorter, electrical resistances are lower and significantly less waste heat is generated. This allows our customers to create smaller, lighter and cooler designs.
Benefits of Power Packaging
- 98 % efficiency
- 40 % higher power density
- Less space required
Smaller, cooler and more efficient
Miniaturization makes it possible to achieve higher power densities, which means a longer range for electric cars and a longer battery life for smartphones. In the EU research project HiEfficient, we have demonstrated that our embedding technology can increase power density by up to 40 percent compared to surface-mounted circuits. By optimizing the thermal properties, a power efficiency of up to 98% can be achieved.
Electric ships, cars and green energy
Power packaging solutions control the power supply in electric cars, charging stations and solar and wind power plants. In the new EU research project HiPower 5.0, an inverter solution for electric ferries and their charging stations in Scandinavia is being developed together with renowned industrial partners, which should enable ships to be charged in just a few minutes with enormous current levels. These power packaging modules will make it possible to replace diesel engines with light and efficient electric drives that reduce CO2 emissions by 65 percent. AT&S’s embedding technology is highly reliable and withstands even the adverse conditions of Scandinavia’s icy waters.
The limits of feasibility
By using semiconductor materials such as gallium nitride or silicon carbide, it is possible to realize transformers, inverters or rectifiers in a smaller space and with less heat generation. Two semiconductors that act as switches to convert the current and the microcontroller to control the system can be packaged into a single, efficient module with AT&S’s unique power packaging technology, delivering unparalleled performance. We are already working with car manufacturers on the next generation of inverters for electric cars, which are significantly smaller, lighter and more efficient than conventional technology and enable range improvements.
Our many years of experience with embedding semiconductor chips, combined with our simulation expertise, allows us to respond very flexibly to customer requirements. We quickly find and design solutions for technical problems that require performance at the limits of what is feasible. Our experts help our customers to implement their ideas and requirements as efficiently as possible.
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If you would like to learn more about our exciting products, technologies and solutions, our experts are always happy to help.