IC Substrates: Custom-made solutions for every scenario
IC substrates from AT&S have been at the heart of modern microelectronics for years. In tandem with the demands of the semiconductor industry to build ever smaller, more efficient and more economical microchips, printed circuit boards have also become smaller and smaller, until the tens of thousands of chip contacts in the smallest possible space made it necessary to develop IC substrates with build-up layers of the highest electrical wiring density. IC substrates (IC, Integrated Circuit) are used to connect highly complex microchips to the printed circuit boards on which the memory, power supply and other important system components are mounted. The conductor tracks on our substrates are now only five micrometers wide. But the limits are not yet exhausted: AT&S is already working at full speed on the development of even more compact substrates with structures that measure only two micrometers across, which will be possible in the future in combination with glass as a carrier material.
AT&S IC substrates reliably supply modern high-performance processors with billions of transistors with data and energy.
Product benefits at a glance
- Substrate technology is crucial for the development of future chip generations
- New materials such as glass are ready for further development
- AT&S’s leading technology is rapidly available worldwide
Bridging dimensions
Flip chip technology is the basis for the interconnect technology and packaging that enable the high-performance semiconductors that power every modern computer and data center. In this process, thousands of connections bridge the contacts of the microchip and the substrate with small solder balls. This type of wiring is efficient and enables contact densities that cannot be achieved with older technologies. At AT&S, we use an advanced build-up process for the production of substrates that is highly automated, non-contact and takes place entirely in a clean room environment.
Production begins with the manufacture of a reinforced core with copper-clad vias that serves as the basis for the build-up of multiple layers of insulating dielectric and copper circuitry. We use state-of-the-art technologies such as our SAP process (semi-additive). This flexible approach is the optimal combination of performance, reliability, and value for industry-leading high-density interconnect technologies.
Supercomputers and 3D scanners
Advanced microchips that rely on substrates to enable integration into electronic systems are not only used in PCs and data centers. The 5G and future 6G networks through which we surf the internet with our smartphones also require powerful electronics to exploit their advantages. The same applies to supercomputers that are used for scientific purposes such as climate simulations or the development of new drugs. Some high-tech applications, such as 3D scanning of the environment, rely on complex sensors that require powerful chips and substrates as well.
Advanced IC substrates are the basis for efficient data processing for AI tools, data centers and cloud applications. AT&S solutions provide more computing power and lower power consumption.
Modern cars rely on a growing number of complex digital systems to enable autonomous driving and modern safety systems. Reliable and highly miniaturized IC-Substrates by AT&S are essential for the digitalization of transport systems.
Wherever people interact with digital technology, IC substrates by AT&S guarantee fast service and low energy consumption. Every high-performance microchip needs an innovative IC substrate to make magic happen.
Computing power for AI and supercomputers
In the future, the demands on substrates will continue to increase as the conventional miniaturization strategies of the semiconductor industry slowly reach their limits. If the number of transistors can no longer be doubled every few years, other ways must be found to further increase computing power and efficiency. This can be achieved by combining several specialized chips in a single, compact computing module. This requires high-quality substrates that reliably supply each chip with data and the right voltage. AT&S is one of the leading manufacturers of high-performance substrates and works with the best semiconductor manufacturers to develop the technical basis for the microchips of tomorrow.
We are already testing glass as a substrate material, which allows even smaller structures and prevents mechanical or thermal deformation from becoming a problem. Such new materials will be combined with multiple advanced packaging concepts for the highly efficient supply of multiple chiplets via a single substrate. We can supply customized IC substrates and our experts help our customers to implement their ideas and requirements as efficiently as possible.
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