Advanced packaging: compute for the data revolution
The latest advanced packaging systems are based on AT&S production technologies that push the limits of what is technically feasible to build the most compact information processing systems ever seen. Over the past decades, the semiconductor industry has benefited from the fact that the number of transistors on a microchip has doubled relatively constantly every two years. As a result, microchips have become increasingly efficient and powerful, making laptops, smartphones and digitalization possible in the first place. This development has recently come to a standstill because the cost of further miniaturization of transistors is rising exorbitantly. To increase the performance of microchips further, the semiconductor industry will increasingly rely on systems that bundle several specialized microchips into a single module.
Advanced Packaging from AT&S is the technological basis for the next generation of high-performance microchips.
Benefits of Advanced Packaging
- Several specialized chiplets in one compact system
- Short signal paths, low electrical losses
- Ultra-fine traces for the next generation of high-performance microchips
The pinnacle of precision: our ECP® printed circuit boards
Embedded Component Packaging (ECP®) is one of the most important drivers of miniaturization in areas such as medical technology and consumer electronics. This technology makes it possible to build thinner and smaller devices without compromising performance.
Substrate for growth
This new strategy requires a completely new approach to the design of computing modules. It is not easy to bundle several tiny microchips or chiplets into one system. The semiconductors have different current and voltage requirements, more heat is generated and the signal paths must be kept as short as possible to avoid losses and ensure efficient data exchange.
This makes such heterogeneous systems a challenge for engineers. Advanced packaging solutions from AT&S make it possible to meet these requirements in the tightest of spaces and still get the best out of every single chiplet in the system. Our substrates prevent distortion due to mechanical stress or heat, can deliver currents of up to 1000 amps and ensure fast and low-loss signal transmission.
Green data centers
Our advanced packaging solutions allow customers to increase the efficiency of their data processing systems significantly. Thanks to our substrates, the next generation of microchips will offer higher performance with lower power consumption. This will not only result in faster laptops and cell phones with longer battery life. The energy-hungry data centers that we need to keep the internet running and to develop the next generation of artificial intelligence can be operated much more efficiently if the computing modules used are precisely matched and optimized for their intended purpose based on a highly advanced substrate.
Z-Interconnect: High frequency meets high performance
Z-Interconnect paves the way for millimeter wave networks with high-performance, integrated antenna solutions. High-frequency applications, such as radar and satellite communication, also benefit from the energy-efficient signal processing of this technology.
The race is on
AT&S uses decades of experience in microelectronics production to further improve our substrates. We are constantly working on further miniaturizing our advanced packaging concepts to accommodate even more functionality in the smallest of spaces. We use embedding, mSAP and coreless substrates to maintain our leading position in this area. To improve our technology even further, we are currently installing first-of-a-kind machinery in our R&D line to develop the next generation of ultra-fine conductor tracks and microvias.
Our experts are already exploring future concepts with glass as a carrier material to ensure that we can meet our customers’ needs even when the traditional materials of the electronics industry reach their limits. We bring all our expertise to bear on the development of customized solutions for every problem and use state-of-the-art virtual development tools to test new designs quickly and cost-effectively. Our engineers help our customers to realize their ideas and requirements as efficiently as possible.
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If you would like to learn more about our exciting products, technologies and solutions, our experts are always happy to help.