Optical Transceivers: Powering the AI data highway
The exponential growth of AI is rewriting the rules of data infrastructure. Optical transceivers sit at the heart of this transformation by enabling ultra-fast, energy-efficient data exchange between GPUs, accelerators, and compute nodes. As speeds move from 800G to 1.6T (gigabits per second/terabits per second) and beyond, performance is no longer optional. It is mission critical.
High-speed optical transceivers are the backbone of modern AI and hyperscale networks. Compared to traditional electrical interconnects, they deliver superior bandwidth density and energy efficiency where next-generation data centers need it most. AT&S supports this evolution with advanced PCB and substrate solutions designed for high-speed optical modules.
From 400G to 1.6T and beyond, AT&S provides production-proven solutions for today and development platforms for the technologies of tomorrow.
High-speed optical transceiver PCB advantages:
Maximum signal performance
Ultra-fine line structures and shortened signal paths reduce loss and ensure high-speed integrity.
Higher integration density
Advanced routing and embedded components enable compact, high-performance module designs.
Thermal and mechanical reliability
Optimized via structures and materials ensure stable operation at extreme data rates.
From PCB to system platform
AI-driven workloads are pushing system architectures to their limits. Data traffic within clusters is surging, upgrade cycles are accelerating, and signal integrity requirements are becoming more demanding.
As optical modules evolve toward higher integration and ultra-high data rates, the PCB becomes a system-critical component. Signal loss, routing density, thermal management, and mechanical stability must be engineered as one cohesive system.
This is where AT&S makes the difference: We combine advanced materials, precision manufacturing, and simulation-driven design into a single, scalable platform.
The shift toward 1.6T, 3.2T, and future multi-terabit architectures demands a new level of integration and miniaturization. Photonic devices move closer to the PCB, signal paths shorten, and tolerances tighten.
Technologies such as mSAP, SLP/HDI, and 2.5D® integration enable ultra-fine routing, reduced loss, and compact system architectures. Combined with advanced packaging approaches like System-in-Package (SiP) and ECP®, AT&S creates the foundation for tomorrow’s optical connectivity.
More speed. Less loss.
High-speed optical modules reward precision at every level. With mSAP, AT&S achieves ultra-fine line widths down to 18 µm, enabling dense routing and improved signal integrity.
Near-vertical copper structures minimize high-frequency loss, while advanced alignment and via technologies reduce discontinuities. The result: cleaner signals, higher bandwidth, and more predictable performance.
At the same time, 2.5D® integration enables the embedding of photonic components directly into the PCB, which shortens interconnects and unlocks new levels of integration.
Built for thermal and system performance
As data rates increase, thermal management becomes a defining factor. AT&S uses advanced via structures and laser trench technologies to significantly improve heat dissipation and reduce thermal resistance in optical modules.
Copper-filled vias enhance mechanical strength and long-term reliability, while optimized material systems reduce conductor loss and stabilize performance. Combined with simulation-driven development, this ensures robust operation across demanding environments.
Technical data
| Product features | Technical data |
|---|---|
| Data rates | 400G to 1.6T (roadmap beyond) |
| Line width/spacing | down to 18/22 µm (mSAP) |
| Integration | advanced HDI, 2.5D®, and SiP capabilities |
| Thermal solutions | copper-filled vias, laser trenching |
| Simulation | thermal, mechanical, and signal integrity analysis |
We develop advanced PCB and substrate solutions for high-speed optical transceivers used in AI data centers, hyperscale networks, and next-generation communication infrastructure. By combining mSAP, HDI, 2.5D® integration, advanced thermal concepts, and simulation-driven design, AT&S helps enable lower signal loss, higher routing density, improved heat dissipation, and reliable performance for 800G, 1.6T, and future optical module architectures.
Explore how we enable next-level performance in semiconductors & modules and future-ready communication & 5G infrastructure.
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