New infrastructure project “Exploration!PVD” launched

As part of its R&D activities, AT&S has decided to purchase a Clusterline 600 physical thin-film deposition system from Evatec. This system will enable AT&S and you to immerse yourselves in the world of semiconductor processes. This process technology is so innovative that AT&S is currently the only European printed circuit board and IC substrate manufacturer to operate such a system. The new technology is used for the development of next-generation IC substrates, novel embedding concepts, heterogeneous integration, advanced packaging, and FO-PLP (fan-out panel level packaging).

The PVE/PVD system at a glance:

• Substrate sizes from coupons (3×3 cm) up to 625x625mm
• Titanium deposition: 25-100 nm
• Copper deposition: 25-300 nm
• Materials: FR4 and films (e.g., polyimide, ABD, etc.)

Location:

• Leoben/Hinterberg, Austria

Purpose:

• Coating of dielectric PCB material with titanium and copper
• Contacting of embedded components (no copper termination on the front/back side) without laser drilling.
• Reactive etching
• Coating of z-axis connections of next-generation printed circuit boards/IC dielectrics

Highlights:

• Clean room with ISO6/8
• Atmospheric degassing oven (under nitrogen atmosphere)
• Static substrates during processing for best cooling and particle performance
• Built-in metrology for residual gas analysis

Book your trails:

Do you have an idea? Then take advantage of this unique opportunity to conduct trials with a completely new technology that is not yet established in the printed circuit board/IC-S industry. Thin-film deposition has become indispensable in the semiconductor, optical, and tribological worlds. You now have the opportunity to test these new concepts in advance.

The testing options include experiments on:

• Vacuum suitability of the materials envisaged for your application
• Thin-film coatings on novel printed circuit board materials or embedded components