More range, more efficiency – AT&S launches HiPower 5.0 research project for smart electric transport

Published On: August 14, 20252.3 min read453 words

Leading European technology companies and research institutions launch joint project to develop highly compact and intelligent drive solutions for sustainable mobility in the automotive and shipping sectors.

Leoben, August 14, 2025 – Austria’s leading microelectronics manufacturer AT&S is participating as a strategic partner in the EU research project HiPower 5.0, which will develop new solutions for semiconductor integration and control systems for highly compact and smart electric drive components. These innovations will bring greater efficiency and thus longer ranges. The kick-off meeting took place in Graz in July. During the meeting, the participants presented the work packages and agreed on the use cases, creating a solid foundation for future collaboration.

“Our contributions to top European research initiatives such as the ‘European Chips Act’ with the HiPower 5.0 project show that AT&S researchers are at the forefront internationally. Our technology developments are crucial to enabling efficient and sustainable systems for a livable tomorrow,” says Mike Morianz, Program Manager R&D at AT&S.

The EU-funded project builds on the successes of the completed HiEFFICIENT initiative and marks a further milestone in technological development. AT&S will contribute its extensive expertise in high-performance printed circuit board technology and semiconductor integration, which are crucial for the next generation of e-mobility.

AT&S is at the wheel

AT&S is a technology leader in the integration of semiconductors used to control and adjust electrical currents with high voltages. Using state-of-the-art production techniques to integrate the latest wide band gap (WBG) semiconductors made from materials such as gallium nitride or silicon carbide, AT&S can manufacture high-quality components that guarantee significantly lower losses, increased lifetime, optimal thermal management and a competitive cost structure. WBG materials replace silicon in the semiconductor components that convert alternating current into direct current or direct current into alternating current in converters. WBG converters are smaller, lighter and more durable while generating less electrical and thermal losses.

Electric vehicles drives with AT&S technology already ensure that electric cars can handle high currents and voltages extremely efficiently, which significantly improves the range and durability of the drives. This also minimizes the power consumption of the systems and allows manufacturers to set their sustainability targets even higher. AT&S’s research department will continue to push the boundaries of what is possible as part of HiPower 5.0.

A total of 45 partners from industry and research are working together on the three-year HiPower 5.0 project. The project is being coordinated by AVL List GmbH. The partners include renowned companies such as Infineon Technologies, Mercedes Benz, Siemens, Renault-Ampere, Schaeffler, Valeo, TDK Electronics as well as numerous universities and research institutes, including SAL, Fraunhofer IZM, TU Chemnitz, TU Turin, TU Eindhoven, Aalborg University and IMEC.

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft – Advanced Technologies & Solutions
AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S develops and produces leading-edge interconnect technologies for key digital industries: mobile devices, automotive & aerospace, industrial, medical and high-performance computing for AI applications. With production sites in Austria (Leoben, Fehring), China (Shanghai, Chongqing), Malaysia (Kulim), India (Nanjangud) and a European competence center for R&D and IC substrate production in Leoben, AT&S is actively shaping the digital transformation – through forward-looking investments in research and development and the responsible use of resources. The company currently employs around 13,000 people.

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Gerald Reischl

Gerald Reischl

Vice President Corporate Communications

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