Design Excellence: Findings from the Pan‑European Electronics Design Conference

The Pan‑European Electronics Design Conference (PEDC) is one of Europe’s most important gatherings for engineers, researchers and innovators in electronics design. Jointly organized by the Electronics Design and Manufacturing Association (FED) and the Global Electronics Association, the conference offers a unique platform for peer‑reviewed technical exchange.  

The 2026 edition took place from January 21 to 22 in Prague, uniting Europe’s electronics community under the banner of advancing electronic design “from Silicon to Systems.”

Designing for excellence

In advanced PCB and IC substrate development, successful design begins with a clear translation of system requirements into a set of electrical, mechanical and thermal constraints. High‑performance interconnect platforms demand careful consideration of power efficiency, component behavior and overall circuit architecture. This reflects essential principles of modern electronics design such as optimized power consumption and strategic component selection.

At the same time, engineers must utilize stack‑ups, routing strategies and material systems that ensure signal integrity, controlled impedance, low electromagnetic interference and robust heat dissipation. These technical decisions are driven by the need to create reliable, manufacturable interconnect solutions that integrate seamlessly in densely packed applications ranging from high‑speed computing modules to ultra-fast communication infrastructure.

AI in Electronics Design: Opportunities, realities and limitations

One of the defining themes at PEDC was the advent of AI‑assisted design tools. Adopting AI in electronics design workflows brings some benefits, but it is important to separate hype from reality. On the one hand, AI enables faster time‑to‑market, delivers higher‑quality and more reliable designs, allows engineering teams to accomplish more development with the same resources and reduces overall product development risk.

On the other hand, it is critical to carefully select what data to share with AI tools, as it is often unclear where confidential data ends up. This makes these systems currently unusable when designing actual customer projects. Design for compliance requires strict control over data flows, transparent handling of sensitive design files and assurance that all processes meet regulatory, contractual, and security obligations.

Embedding Technology: Enabling high‑density, high‑performance integration

Another standout topic this year was simulation‑driven design, which was also emphasized in the presentation of from Janagan Papperi, Hardware Development Engineer at AT&S. His talk was titled “PCB Embedding Technology: A pathway to enhanced product integration”.

PCB embedding technology is transforming the way next‑generation electronic systems are built by integrating active and passive components directly into the inner layers of the PCB rather than mounting them on the surface. This approach enables substantial miniaturization while simultaneously improving electrical performance and enhancing thermal management, making it ideal for high‑density, high‑performance applications.

The demand for increased product integration is driven by several technology trends. In consumer electronics, innovation focuses on creating smaller and more capable systems, supported by improved electrical performance achieved through minimized signal paths and EMI (electromagnetic interference). Effective thermal management is guaranteed by strategically placing heat‑generating components to maintain optimal operation. At the same time, enhanced reliability and efficiency ensure that high‑performance systems can operate dependably in harsh environments.

Embedding components into PCBs comes with challenges that need to be managed throughout the development process. Engineers need to consider complex thermal management, evaluate the risk of warpage, deal with simulation to optimize electrical and mechanical performance and use tools supporting the handling of embedded components.

However, the benefits are compelling. Designers can achieve considerable size reduction, improved signal integrity and better heat dissipation when comparing standard PCBs with embedded PCBs. This technology greatly impacts and supports the next generation of high-performance electronics.

Building smarter, faster and more reliable products – the PEDC takeaway

PEDC 2026 stands out as a European hub for anyone shaping the electronics of tomorrow. With its mix of deep technical content, peer‑reviewed insights, and forward‑looking themes, from AI‑enhanced design to simulation‑driven development, the conference empowers engineers to build faster, smarter and more sustainable products.