Advanced PCB solutions for reliable satellite communication
Satellite communication systems demand exceptional signal performance, miniaturization, and engineering precision. AT&S supports aerospace and satellite innovators with advanced PCB technologies, engineering expertise, and European manufacturing capabilities to accelerate the development of next-generation communication modules and satellite platforms.
Why is reliable communication critical for next-generation satellite systems?
Higher frequencies, increasing bandwidth demands, and extreme operating conditions make reliable communication a critical requirement for modern satellite platforms. Our advanced PCB and substrate technologies provide the foundation for next-generation satellite communications. As a trusted development partner, we combine leading technologies with in-house engineering expertise to solve complex design challenges and accelerate innovation.
Radio Frequency Electronics
Z-Interconnect Technology
ECP® Technology
Flexible and rigid-flex PCB
HDI PCB
Thermally enhanced PCB
Substrate-like PCB
mSAP
Why choose AT&S for your next aerospace project?
Engineering expertise
Leverage deep expertise in high-performance PCB design to optimize signal integrity, thermal management, miniaturization, and manufacturability for demanding space applications.
European manufacturing excellence
Partner with Europe’s leading PCB manufacturer, combining advanced technologies, engineering support, and aerospace manufacturing expertise.
Faster time-to-orbit
Reduce development risk and accelerate time-to-market through simulation-driven development, rapid prototyping, and manufacturing-focused engineering.
Certified quality
ISO EN 9100 certified and NADCAP accredited manufacturing processes ensure the reliability required for aerospace applications.
Contact our aerospace experts
FAQs: Aerospace capabilities
Every kilogram launched into orbit increases mission costs. Lightweight AT&S PCBs help reduce launch mass, improve payload capacity, and enable more compact system designs. AT&S advanced HDI and embedding technologies support significant weight and space savings.
Absolutely. AT&S provides advanced PCB solutions specifically designed for high-frequency and high-speed satellite communication systems. By combining HDI, ECP®, mSAP, and Z-Interconnect technologies with low-loss materials and RF-optimized designs, AT&S helps customers achieve excellent signal integrity, reliable data transmission, reduced signal loss, and high performance in demanding space environments. These solutions are used in applications including satellite communications, telemetry and command systems, RF payloads, antenna systems, and ground station infrastructure.
Satellite communication above 50 GHz requires advanced RF PCB technologies that minimize signal loss and maintain signal integrity at millimeter-wave frequencies. AT&S key technologies include ultra-low-loss materials, HDI architectures, mSAP technology, air-filled waveguides, Z-Interconnect technology, and antenna-integrated RF solutions. Together, these technologies enable higher data rates, lower transmission losses, improved signal integrity, and more compact satellite communication systems.
Advanced PCB design helps reduce satellite system complexity by integrating performance, manufacturability, and reliability considerations from the earliest development stages. AT&S’ simulation-driven design approach and early manufacturing collaboration minimize redesign cycles, simplify system integration, and enable faster, more predictable industrialization.
AT&S complies with the highest aerospace quality standards and is certified according to EN 9100 (equivalent to AS9100D). In addition, AT&S holds a NADCAP Gold accreditation, ensuring that our manufacturing processes meet the stringent quality and reliability requirements of the aerospace and defense industry.