International Trainee Program

  

Grow with AT&S!

AT&S INTERNATIONAL TRAINEE PROGRAM

You have a university degree in engineering or a scientific discipline, 1 to 2 years of fulltime work experience and are seeking an opportunity to live abroad and explore the world?

You want to drive your technical career on an international level in either a technical or sales position? Our trainee program starting in autumn 2018 offers the unique opportunity to participate in a 12-month professional training in Austria to gain professional insight into the printed circuit board and IC substrates world . After the completion of the trainee program you are ready for a 3-year international assignment to one of our flagship manufacturing facilities in China, India or our sales offices around the globe. After those 3 years you will be highly qualified for any open positions within the AT&S Group.

 

What we offer:

  • Positions in the area of operations and sales
  • Support and growth through a tailor-made mentoring program
  • A comprehensive portfolio of intercultural, functional, soft skill and quality trainings
  • Interesting and exciting (inter)national projects
  • Attractive and performance-oriented compensation & salary package
  • Personal and professional growth opportunities in a multinational, dynamic company
  • A challenging, vibrant positive and rewarding working atmosphere

 

  
  • "You have to move with the times or get left behind.“ Heinz Moitzi, COO

You have to move with the times or get left behind. This statement has always been true for the electronics industry. As the team of AT&S, we have confronted this challenge very successfully for years. We work on shaping the electronics world of tomorrow with our international customers and their applications. In order to ensure that we can continue our success of the past also in the future, we need you – your talent, your commitment, your open-mindedness and ideas. Together, we can tackle the wide variety of challenges of the big electronics world and play an important role in further shaping miniaturization.”

Heinz Moitzi, COO