Mobile Devices and Substrates

Real-time connectivity is the driver of tomorrow’s applications – from mobile devices to the Internet of Things to the omnipresent cloud – and generates a global demand for more data, more processing, and more storage power.

The product portfolio of AT&S comprises not only PCBs for system applications such as motherboards, but also for modules, which in turn are assembled on a motherboard as components, and IC substrates, which form the basis of the housing of an IC.

We are the manufacturers of the high-quality interconnection products that are driving these trends: miniaturization, modularization, energy efficiency and speed.

Our products inspire developers to create devices that are becoming smaller, more powerful and meet the demands of tomorrow’s advanced applications.

Computer-Communication-Consumer

Applications for the connected World

AT&S Business Line Computer-Communication-Consumer (CCC) offers applications including 5G Smartphone, Notebook, Smart Watch, Wireless Stereo, Smart Glasses & AR, Action Camera, Micro/Mini LED and Drone.

With our leading-edge technology in miniaturization, signal speed and signal integrity, AT&S delivers solutions that are the first choice for the connected world.

Solutions for Computer-Communication-Consumer

  • IC Substrates
  • High Density Interconnect PCBs
  • Embedded Component Packaging PCBs
  • 5D® Technology
  • mSAP Technology

Semiconductor

Interconnection technologies for the next-generation

AT&S Business Line Semiconductor offer advanced solutions for applications including Processors, Solid State Drive, Optoelectronics, 3D Sensing and 5G mmWave, Wireless/BT Combo, RF Front End Modules.

From interconnection technologies for next-generation 5G connectivity & communications, sensing & power modules to high-end IC Substrates for data processing in high-performance computing & servers. Our solutions adapted to your needs.

Solutions for Semiconductor

  • IC Substrates
  • High Density Interconnect PCBs
  • Embedded Component Packaging PCBs
  • 5D® Technology
  • mSAP Technology