Embedding Technology for Mobile Devices
Utilising ECP® technology as a module packaging architecture for next generation smartphone and tablet gives dramatic improvements in the areas of
Electronic Packaging footprint reduction
Through ECP® the Designer can stack discrete active and passive components, taking advantage of ECP®’s ultra-thin construction to provide class-leading functional density and form factor
Proven reliability
ECP® has demonstrated through numerous third-party and OEM test regimes that its interconnect technology gives stepped change improvement regarding resistance to mechanical shock
Class-leading Integration concep
Above all, ECP® gives dramatic integration potential, utilising the ECP® substrate as a carrier for other system critical components. The result is a small module footprint with significant reduction in supply chain complexity and “ease of use”