Industrial Sensorics

Embedding Technology for Industrial Sensorics

Ultrasonic, optical, magnetic and other physical sensors are finding their way in to our everyday reality. Using ECP® allows the sensor and driver to be packaged in an ultra-flat, ultra-thin, high performance module that can then easily be integrated with other parts of the electronic system.

MEMS physical sensors

Even MEMS physical sensors can be integrated in to an ECP® package, together with required driver devices to offer the smallest, modular footprint possible.

Due to the durability and robustness of the technology, proven against many Industry test regimes, ECP® can also be used for sensors in aggressive environments and potentially in safety critical applications.

ECP® – the Leading Chip Embedding Technology for Industrial Sensorics