Chip Embedding Technology for Automotive applications

Leveraging the accredited status of AT&S as a TS16949 supplier, ECP® offers dramatic next package generation benefits to the Automotive Industry.

Proven form factor reduction through integrated electronic packaging offers next steps in system performance, supply chain complexity reduction and total cost reductions.

Reliability results have led the Industry’s leading Tier One suppliers to consider ECP® as a viable alternative to Ceramic-based substrates and electronics for safety critical, high temperature needs such as Engine Management Systems and Automatic Gearbox Control Units.

Leading Integration Package

Infotainment and Embedded navigation systems take advantage of ECP® as the leading integration package platform enabling differentiation at a system performance and feature level.

Vehicle sensors, power electronics, wireless security systems all benefit from ECP® through form factor reduction, reliability, thermal performance due to advanced thermal concepts and superior dimensional control.

ECP® – the Leading Chip Embedding Technology for Automotive applications