Facts & Figures
ECP® / Advanced Packaging in Figures
- AT&S Advanced Packaging is located at AT&S’s Corporate Headquarters in Leoben-Hinterberg, Austria
- Commercial embedded component production started in November 2010
- The facility occupies 2.000 sqm of high quality production space within the main building
- The dedicated ECP® Production Fab is fully ESD protected to norm
- Lithography is executed through maskless processes – ECP® uses digital exposure techniques for all photo-structuring operations
- AT&S has invested approximately 15 Mio. Euro in to capital equipment to build the Facility to its current capability, with a dynamic investment plan to reach our roadmap and capacity objectives
- Capacity of single chip ECP® module production is 20 Mio pieces per month
- The line producing ECP® is accredited to the automotive TS16949 standard
- Qualification to the ISO 13485 norm for medical compliance is planned
- AT&S holds 15 patents in the area of embedded component in laminate technology