ECP® is highly competitive
|ECP||IMB||Fan-out WLP||Pop||BGA/LGA||Lead-Frame (QFP, TSCP, ...)||QFN||WL-CSP|
|3D routing (front to back of IC)|
|Large pitch redistribution (no RDL)|
|3D stacking in package|
|3D stacking of packaged ICs|
|IC + discrete integration|
ECP® is highly competitive in comparision to existing packaging types and enables future applications through advanced 3D packaging capabilities.