Business Superbrands Certificate awarded for outstanding brands: AT&S among the winners
8. August 2017, 13:25
The Superbrands Austria Business Brand Council, which consists of technical and industry experts, has chosen AT&S as Business Superbrand for 2017.
First quarter of 2017/18: AT&S starts the financial year with significant revenue growth and improved earnings
26. July 2017, 17:49
Leoben, 17:46. After more than one year of production at the plants in Chongqing, China, which initially had a significant influence on the profitability of AT&S, a clear upward trend is showing and, consequently, a positive development of revenue and earnings compared with the previous year.
AT&S paves the way for autonomous driving and high-speed communication
6. July 2017, 16:24
The automotive industry is focusing its efforts on developing solutions for autonomous driving and car-to-car communication.
Results 23rd AT&S Annual General Meeting
6. July 2017, 13:52
Today’s 23rd Annual General Meeting of AT & S Austria Technologie und Systemtechnik Aktiengesellschaft (AT&S) adopted a dividend of EUR 0.10 per no par share entitled to a dividend for the financial year 2016/17.
AT&S: Change in the Management Board
2. June 2017, 14:26
Karl Asamer, CFO of AT&S since 2014, resigned his Management Board mandate early for personal reasons at today’s Supervisory Board meeting.
ECP® technology from AT&S enables evaluation of a fully integrated multilevel power converter on GaN basis
25. April 2017, 10:31
Fraunhofer IAF developed monolithic multilevel voltage converter with high-volt GaN-on-Si technology – test setup with embedding power technology from AT&S demonstrates high performance of the circuit. Leoben, 25 April 2017 – Fraunhofer IAF has developed a fully integrated monolithic multilevel converter in high-volt AlGaN/GaN-on-Si technology. The integrated inverter circuit is designed for maximum
AT&S advances PCB, module and packaging technologies
1. March 2017, 11:49
Participation in key industry consortia to develop innovative GaN processes and panel-level packaging Leoben, March 1st 2017 – For years, AT&S has worked at the forefront of process and technology development to meet the challenges of continued miniaturization and the demand for better energy efficiency. In this context, the company is involved in
World’s smallest speaker uses PCB technology and system integration expertise from AT&S
6. February 2017, 14:54
USound and Fraunhofer Institute develop micro-speaker with innovative MEMS technology Leoben and Graz, 06 February 2017 – Graz-based start-up USound, in partnership with several Fraunhofer Institutes (IDMT, ISIT, IIS and IZM) and utilizing PCB technology together with system integration expertise from AT&S, has developed what is not only the world’s smallest speaker, but
Financial year 2016/17: AT&S with increased revenue in the first nine months and operational improvements at the new plant in China
30. January 2017, 19:34
Continued good demand in all key customer segments In the core business, AT&S increased relative profitability Revenue 5.3% above the strong prior-year level; third quarter was on record level EBITDA adjusted for the start-up effects from Chongqing rose by 8.5% compared with the previous year, the adjusted EBITDA margin was at 26.0%; the
Panel Level Packaging Consortium Takes Up Its Work
12. January 2017, 16:17
Revolutionizing packaging technology: The Fraunhofer Institute for Reliability and Microintegration IZM is spearheading the transition from fan-out wafer to fan-out panel level packaging with an initiative that has brought together illustrious international partners – innovative SMEs as well as global players. The global nature of the partnership meant coping with often conflicting time